Double Chamber PVD Coater System For Thin Film Deposition Preparation

Category

Description

Application

Preparation of nanoscale monolayer/multilayer functional films (hard coatings, metallic/semiconductor/dielectric films). Suitable for research labs, universities, and small-batch production.

Key Features

• Anode-layer ion source (cleaning + assisted deposition) 

 • Reverse sputtering for adhesion enhancement 

• Automated PC-controlled process

System Structure

Sputtering chamber, 3 magnetron targets, heating stage, DC/RF power supplies, gas/pumping systems, vacuum measurement, control unit.

Parameter

Specification

Chamber Design

Vertical front-loading, stainless steel construction

Base Vacuum

≤5×10^－5 Pa (sputtering chamber)

Pumping Speed

Recovers to 5×10^－4 Pa in 100 min (via bypass valve + turbopump)

Leak Rate

≤5×10^－7 Pa·L/s

Pressure Rise Rate

≤10 Pa after 12 hours (power off)

Pumping System

Domestic turbomolecular pump + mechanical pump

Targets

3 × 3-inch HV targets (2 standard, 1 strong magnetic field)

Power Supplies

• RF: 600 W, 13.56 MHz (auto-matching) 

 • DC: 2 × 1000 W

Target-to-Sample Distance

40–120 mm (adjustable)

Substrate Heating

Max 450°C, programmable (rate/dwell time controllable)

Film Thickness Uniformity

±5% (e.g., Cu/Al: 4–5 μm; Ni/PTFE: 1–2 μm over 2-inch area)

Adhesion Strength

Survives 3 tape-peeling tests (glass/Si/ceramic)

Pre-Cleaning

Reverse sputtering + anode-layer ion source

Gas Control

2 MFCs (Ar + reactive gases), MKS-brand, mixing enabled

Baking

IR heating, max 150°C

Safety

Water/power failure interlocks, anti-misoperation protection

Automation

PC-controlled (target switching, substrate rotation, temperature)

Feature

Benefit

Target Applications

Ion Source + Sputtering

Ensures clean surfaces and high adhesion

Semiconductor films, optical coatings

Multi-Mode Deposition

Supports DC/RF, reactive sputtering, multilayers

Research on novel functional materials

Precise Automation

Reduces human error, improves reproducibility

Small-batch prototyping, academic labs

Rapid Pumping

Minimizes downtime between runs

High-throughput R&D environments