Multi-Material Deposition Magnetron Sputter Coating System Equipment For Organic Multilayer

Category

Parameter

Details

Vacuum Performance

Ultimate Vacuum (Sputtering Chamber)

≤6.6×10⁻⁶ Pa

System Leak Rate

≤5.0×10⁻⁷ Pa·L/S

Pump-Down Time (Atmosphere → 6.6×10⁻⁴ Pa)

≤30 min

Vacuum Retention (After 12 Hours Shutdown)

≤5 Pa

Sputtering Chamber

Structure

Vertical, top-opening, stainless steel (argon-welded, electropolished)

Dimensions

≥Ø300 mm × 300 mm (with anti-contamination liner)

Bakeability & Sealing

100–150°C; metal gasket/fluororubber O-ring

Magnetron Sputtering

Target Configuration

3 × 50 mm adjustable-angle permanent magnet targets (RF/DC/MF compatible)

Power Supply

2 × DC (≥500 W), 1 × auto-matching RF (≥500 W)

Film Uniformity

≤5% deviation

Additional Features

3 × SMC rotary shutters; magnetic material support

Substrate Stage

Sample Capacity

1 × ≥100 mm diameter

Rotation Speed

0–30 RPM (adjustable)

Heating Range

RT–500°C (PID-controlled, thermocouple feedback)

Gas Delivery

Mass Flow Control

2 paths (100 SCCM + 20 SCCM MFCs, CF16 valves)

Auxiliary Gas Lines

2 × DN16 inlet valves

Pumping System

High-Vacuum Pump

Pfeiffer Hipace 700 (680 L/s) + 4 L/s rotary pump

Valves & Pipeline

DN40/CC150 pneumatic valves, stainless steel bellows

Control & Safety

Automation

PLC + industrial PC + touchscreen (real-time monitoring/logging)

Protection

Interlocks for water/power faults (overcurrent, open circuit, etc.)

Additional Components

Frame

Steel construction, lockable casters, removable panels

Included Accessories

Chiller, silent compressor, tool kit, spare parts

Measurement

Vacuum Gauge

INFICON combination gauge