Laser Scribing Device

High Accuracy Laser Scribing Device with Visual Guidance for Thin Film Battery Manufacturing

  • Model Number:

    TMAX-KT-PMUV8

  • Compliance:

    CE Certified

  • Warranty:

    One year limited warranty with lifetime technical support

  • Place of Origin:

    China

  • Shipping Port:

    Xiamen Port

  • Payment:

    L/C D/A D/P T/T Western Union

  • Delivery Time:

    5 days

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Product Details

Drawer Type Ultraviolet Ozone Cleaner Instrument



 

 

1. Product Application: Laser Precise Micro-Processing

This equipment is equipped with a picosecond ultraviolet laser and a high-precision CCD vision system. Combined with high-performance peripheral configurations, it is mainly used for processing thin film materials. This equipment is mainly applied to laser marking of thin film batteries, especially excelling in the preparation of perovskite battery modules, and can achieve high-precision processing of the four processes P1-P4.
2. Specification Overview

2.1 Equipment Name and Model

High Precision Visual Positioning Laser Marking Device: KT-PMUV8

 

2.2 Equipment Parameters

 

Equipment Name

High-precision visual laser marking device

Equipment model

KT-PMUV8

Workstation number: Single workstation

Equipment dimensions

1500mm* 950mm*1950mm

Types of lasers

Semiconductor pumped laser (355nm)

 

Laser (customizable)

8W @500KHZ；

Pulse width < 20 ps

Pulse stability: less than 2% RMS over 10 minutes

Output light spot: (3) ±0.2 mm

M²:＜1.2

Cooling method: Closed-loop water cooling system

Musculoskeletal System:

 

 

 

X-axis

Processing size: 150mm

Resolution: 0.1 um

Maximum movement speed: 300mm/s

Acceleration: 0.5g

Acceleration and deceleration time: 0.1s

Acceleration and deceleration distance: approximately 13mm

Positioning accuracy: ±20um

Repeatability positioning accuracy: ±10  um

 

 

 

Y-axis

Processing size: 150mm

Resolution: 0.1 micrometer

Maximum movement speed: 300mm/s

Acceleration: 0.5g

Acceleration and deceleration time: 0.12s

Acceleration and deceleration distance: approximately 10mm

Positioning accuracy: ±20um

Repeatability positioning accuracy: ±10um

 

 

Z -axis

Travel: 200mm

Resolution: 0.10um

Maximum movement speed: 20mm/s

 

Positioning accuracy: ±25 um

Repeatability positioning accuracy: ±10 um

Motion controller

Ethercat scan cycle ≤ 1ms

Workstation style

Manual clamping fixture

Loading and unloading method: Manual

Dust-proof

1-layer dustproof design

Positioning system: Visual positioning

 

Alignment method

Paraxial positioning

Aligned shot

Optical magnification: 0.5 times

Pixel: 1200W

Focus lens

Optical magnification: 6 times

Pixel: 1200W

 

Camera spectrum: Black and white

Pixel size: 3.45um x 3.45um

Light source

Structure: Point light source

Wavelength: Red light; Power: 3W

Processing system

Focus mode

Power measurement

Image (automatic/semi-automatic) focusing

Focusing range: 0.1mm  Focusing accuracy: ±15 μm

Mirror prism

15W power meter probe (optional)

Repetition scanning accuracy

SCANLAB

Field lens: F210

Focus mode

±15um

Maximum scanning area

150mm*150mm（F210）

Maximum scanning speed

10000mm/s (Linear)

Focus spot size

25um（1/e² )

Blowing method

No blowing air

Dust prevention

Smoke-free purifier

Air volume:

Processing software:

Software environment

Windows 10 operating system  

 Software version:  Simplified Chinese

Software version number

 

 

Software permission classification

Level 3: Super administrative privileges; Engineering staff privileges; Operator privileges

Software parameter file

Storage, import, export; provide multi-dimensional motion parameters, laser parameter control;

Software log display

Perform real-time monitoring of the laser, platform and all I/O ports; display error messages in case of failure;

Drawing import format

Directly import, store or export CAD software files in formats such as DXF and DWG;

Graphic online editing

Editing of straight lines, curves, arcs, polygons and simple irregular shapes;

Graphic error correction

Providing alarm prompts for abnormal shapes

Automatic marking point capture

Offering mark point graphic learning, supporting four target point positioning;

Semi-automatic focusing

Provide semi-automatic image focusing function;

Image correction

Provide semi-automatic image correction function;

Graphic measurement

In conjunction with the imaging system, the software can perform simple size measurement on the processed workpieces;

Other customized functions

Customized development can be provided according to the characteristics of the product processing technology.

 



2.3 Factory Requirements


l Suggested factory layout:

 

         


l  Factory Layout:

Power supply

Single-phase 220VAC, 50Hz, 20A

Compressed air

0.4 - 0.8 Mpa, quick connector, 10mm air pipe, gas consumption 3m3/h

Environmental temperature

Temperature 18 - 26℃, temperature variation within ±1℃/24HR, no strong convective air

Environmental humidity

It should be maintained within the range of 35% to 65%.

Cleanliness requirements

Class 106 or better would be preferable.

Load-bearing requirements for the base plate

More than 850kg/㎡

Equipment weight

About 1.6t

Total equipment power consumption

2.7KW

 

2.4 Equipment Maintenance Cycle

Component

Suggested maintenance period

Maintenance Contents

Method

Laser

6 months

Power Optimization

Remote maintenance

Optical path

3 months

Lens Cleaning, Optical Path Adjustment

Technician maintenance

Exercise platform

3 months

Adding Lubricating Grease

Technician maintenance

Caravan

6 months

Flatness

Image focusing

Water-cooled machine

2 months

Replace distilled water

Self-replacement

Dust collection fan

12 months

Replace filter element

Self-replacement

Other

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Related Tags :

Laser Scribing Device High Accuracy Laser Scribing Device Laser Scribing Device for Thin Film
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