Compact Laser Scribing Machine for ITO FTO and Flexible Conductive Substrates

Compact Laser Scribing Machine for ITO FTO and Flexible Conductive Substrates   Usage Introduction: This is a small laser etching machine equipment, used for etching and marking lines on ITO/FTO and flexible conductive substrates. It can also be used for removing other films, marking lines and cutting silicon wafers, etc. Technical Specifications Laser Power 20W Wavelength 1064nm Service Life 100,000 hours Software Support Compatible with dedicated software, AutoCAD, CorelDRAW, Photoshop, and other software formats. Frequency Range 20-80KHz Max Engraving Size 100mm~150mm Min Line Width <0.02mm Machine Dimensions 300*460*700mm Outer Box Dimensions 600*270*600mm Other Configurations Touch-screen computer, hidden keyboard and mouse, one-year free warranty. Free Gifts One suitcase, a quantity of conductive glass, free training