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Sputter Coater

Multi-target Magnetron Sputtering Coating System For Multilayer Thin Film Fabrication

  • Model Number:

    TMAX-TK-JS01
  • Input Power:

    2000W
  • Compliance:

    CE Certified
  • Warranty:

    One Year limited warranty with lifetime support
  • Shipping Port:

    Xiamen
  • MOQ:

    1
  • Payment:

    L/C D/A D/P T/T Western Union
  • Delivery Time:

    5 days
Product Details

Multi-target Magnetron Sputtering Coating System For Multilayer Thin Film Fabrication 

 

 

Model: TMAX-TK-JS01-Multilayer Thin Film Fabrication


Technical Parameters

Parameter

Specification

Model

TMAX-TK-JS01

Vacuum Chamber Structure

Vertical top-opening design, manual gas spring lift

Chamber Dimensions

Φ220mm × H300mm

Heating Temperature

Room temperature to 500°C

Substrate Holder Size

Φ100mm (rotatable, heated)

Film Uniformity

≤ ±5.0% within Φ50mm area

Sputtering Target

1 × Φ2-inch magnetron target (DC/RF compatible)

Process Gas Control

1–2 channels, precision ±0.1 sccm

Control System

PLC + touchscreen interface

Footprint (Main Unit)

600mm (L) × 800mm (W) × 1700mm (H)

Power Consumption

≥6 kW

Base Vacuum

6.6×10⁻⁵Pa

Pumping Time

≤15 min (from atmosphere to 7×10⁻³Pa)


Applications

Designed for thin-film researchand small-batch production, ideal for:

· Academic labs: Universities and research institutes studying novel materials.

· Industrial R&D: Prototyping functional coatings (e.g., ITO for solar cells, wear-resistant alloys).


Key Features

1. Multi-Mode Sputtering

·Supports DC, RF, and pulsed sputtering for metals, oxides, and semiconductors.

·Single-/multi-target configurations for layered or composite films.

2. User-Friendly Operation

·Automated PLC control with real-time monitoring via touchscreen.

·Substrate heating (≤300°C) and rotation (2–20 rpm) for uniform coatings.

3. Compact & Reliable

·Minimal footprint, low maintenance, and energy-efficient design.

4. Safety & Precision

·Water-cooling protection, gas flow control (±0.1 sccm), and arc suppression.


Quick Start Guide

1. Installation:

·Ensure stable power (AC 380V ±5%, ≥8 kW), cooling water (≥10 L/min), and proper grounding (<3Ω).

·Verify vacuum seals and gas connections before startup.

2. Operational Workflow:

·Pumping: Start mechanical pump → Open foreline valve → Activate molecular pump (at >5 Pa).

·Deposition: Set substrate temperature → Adjust gas flow → Initiate sputtering (5–15 W/cm² target power).

·Shutdown: Cool substrate (<50°C) → Vent chamber → Maintain pump oil/clean seals regularly.

3. Maintenance Tips:

·Replace mechanical pump oil every 500 operational hours.

·Clean chamber and target surfaces after each use to avoid cross-contamination.


Summary

The  TMAX-TK-JS01 combines research-grade precision with industrial durability, offering:

· Flexibility: Adaptable to diverse materials (metals, dielectrics, etc.).

· Efficiency: Fast pumping, intuitive controls, and low running costs.

· Support: Comprehensive manuals and technical assistance provided.

For advanced applications (e.g., perovskite layers), consult the manufacturer for tailored process parameters.

 

Thin Film Fabrication

 Multi-target Magnetron Sputtering