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Sputter Coater

RF Sputtering Coater System For Solar, OLED & Semiconductor

  • Model Number:

    TMAX-PD-JS05
  • Input Power:

    2000W
  • Compliance:

    CE Certified
  • Warranty:

    One Year limited warranty with lifetime support
  • Shipping Port:

    Xiamen
  • MOQ:

    1
  • Payment:

    L/C D/A D/P T/T Western Union
  • Delivery Time:

    5 days
Product Details

 RF Sputtering Coater System For Solar, OLED & Semiconductor

 

Model:  TMAX-PD-JS05-Wafer Sputtering Coater System


Product Overview

The TMAX-PD-JS05 magnetron sputtering system is equipped with multiple sputtering sources, capable of depositing metallic, semiconducting, and dielectric materials. It supports the fabrication of multilayer thin films and co-sputtered alloy films with high precision.

Key Features

· Compact & Integrated Design: Space-saving layout with refined aesthetics, optional sample-loading functionality.

· High Uniformity Coating: Features 4× magnetron sputtering targets (2–4 inches), compatible with 2–8 inch wafers. Substrate holder ensures uniformity within ±3%–5% for 8-inch wafers.

· Flexible Control Options: Siemens PLC + touchscreen (manual/automatic) or PC + PLC full-automatic control.

Technical Specifications

· System Dimensions (L×W×H): 1400 × 1300 × 1900 mm

· Chamber Dimensions (L×W×H): 500 × 500 × 500 mm (PD-500C) / 600 × 600 × 500 mm (PD-600C)

· Substrate Stage: Max heating temperature 500–800°C

· Base Pressure: ≤5 × 10⁻⁵ Pa

· Pumping & Holding: Achieves 8 × 10⁻⁴ Pa within ≤30 min; pressure rise ≤8 Pa over 12 hours.

· Target Configuration: 4× sputter guns (2–3 inches or 2–4 inches), coating area 2–6 inches.

Applications & Advantages
Ideal for R&D and small-batch production, the PD-500C/600C excels in depositing high-quality, uniform thin films for optics, electronics, and functional coatings. Its modular control and excellent temperature/vacuum stability cater to advanced material research and industrial precision demands.

TMAX-PD-JS05 vs. Conventional Model

Feature

 

Conventional Systems

Advantage

Uniformity (8-inch wafer)

±3%–5%

±5%–10% or worse

Higher film consistency for precision applications

System Footprint

Compact (1400×1300×1900 mm)

30–50% larger

Saves lab/cleanroom space

Substrate Heating

500–800°C

Typically 300–600°C

Supports high-temperature depositions (e.g., oxides, nitrides)

Base Vacuum

≤5×10⁻⁵ Pa

~1×10⁻⁴ Pa

Better for reactive sputtering, reduced contamination

Pressure Stability

≤8 Pa over 12 hours

Frequent drift (>10 Pa in hours)

Longer process stability

Control Options

PLC + Touchscreen or PC + PLC

Manual or basic PLC

Flexible automation, better reproducibility

Target Configuration

4× guns (2–4 inch)

Often 2–3 guns (2–3 inch)

Wider material selection, co-sputtering capability

Coating Area

2–8 inch wafers

Typically ≤6 inch

Broader substrate compatibility


Key Takeaways

· Precision & Consistency: Superior uniformity (±3–5%) vs. conventional (±5–10%).
· Compact & Efficient: 30% smaller footprint without sacrificing performance.
· High-Temp & Vacuum Stability: Enables advanced materials (e.g., optical coatings, semiconductors).
· Automation Ready: PC-controlled processes improve repeatability over manual systems.

Ideal For: R&D labs, semiconductor fabs, and optical coating producers needing high-repeatability, multi-material deposition in a space-efficient design.

 Semiconductor Film Deposition

Optical Sputtering Coater