PVD DC Sputtering Coating System For Oxides & Ceramics & Semiconductors

PVD DC Sputtering Coating System For Oxides & Ceramics & Semiconductors   Model: TMAX-BY-JS09| – Product Specifications Product Overview The TMAX-BY-JS09 is a compact, high-vacuum magnetron sputtering system specifically designed for glovebox-integrated applications. Its space-saving flush-mount design allows the observation window to align perfectly with the glovebox wall, eliminating internal space occupation—a common limitation of traditional sputtering systems. Since its launch, this system has been widely adopted by research institutions for its efficiency and precision. Technical Specifications Category Specification Vacuum System Rotary vane pump (oil) + Turbo molecular pump (oil-free) Pumping Speed Rotary pump: 16 m³/h (4.4 L/s) @50Hz / 19.2 m³/h (5.2 L/s) @60Hz  Turbo pump: 300 L/s Ultimate Vacuum 5×10⁻⁵ Pa Working Pressure 0.5–5 Pa Pump-Down Time ≤10 min (to 10⁻³ Pa) Vacuum Measurement From atmosphere to 10⁻⁶ Pa Gas Control Precision gas flow controller Chamber Size φ260 mm × 200 mm (metal) Sputtering Target φ50 mm × 3 mm (Cu target); suitable for weakly magnetic materials Power Supply AC 220V 50Hz or AC 110V 60Hz Power Consumption ≤3000 W Cooling System Air cooling (pump) + Water cooling (sputtering target) Dimensions & Weight 610 mm (L) × 420 mm (W) × 490 mm (H) / ~100 kg Warranty 1-year limited warranty, lifetime technical support Key Features & Customer Benefits 1. Space-Saving Glovebox Integration · Problem Solved: Traditional sputtering systems occupy valuable glovebox space, limiting workflow efficiency. · Our Solution: The flush-mounted design minimizes protrusion, allowing seamless integration without compromising internal workspace—ideal for labs with limited glovebox capacity. 2. High-Performance Vacuum & Fast Pump-Down · Achieves 5×10⁻⁵ Pa ultimate vacuum, ensuring ultra-clean deposition conditions for sensitive materials (e.g., semiconductors, optical coatings). · Rapid pump-down (≤10 min to 10⁻³ Pa) reduces idle time, enhancing lab productivity. 3. Precision Process Control · Stable gas flow control enables repeatable deposition rates, critical for uniform thin-film growth. · Broad vacuum measurement range (atmosphere to 10⁻⁶ Pa) ensures accurate monitoring across all process stages. 4. Versatile Material Compatibility · Supports argon and other process gases for reactive/non-reactive sputtering. · Accommodates 50mm targets (Cu standard, customizable for weakly magnetic materials). 5. Reliable Cooling & Safety · Hybrid air + water cooling prevents overheating during extended operation, ensuring system longevity.       html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; }