products categories

contact us

products
Sputter Coater

DC/RF Nano Sputtering Coater Film Deposition Equipment With Rotatable Triple-targets

  • Model Number:

    TMAX-PC-JS03

  • Input Power:

    2000W

  • Compliance:

    CE Certified

  • Warranty:

    One Year limited warranty with lifetime support

  • Shipping Port:

    Xiamen

  • MOQ:

    1

  • Payment:

    L/C D/A D/P T/T Western Union

  • Delivery Time:

    5 days
Product Details

DC/RF Nano Sputtering Coater Film Deposition Equipment With Rotatable Triple-targets

 

 

Model: TMAX-PC-JS03-Rotatable Triple-targets 

Technical Specifications

Category

Parameter

Value/Description

Chamber Structure

Design

Vertical front-loading, stainless steel

 

Sample Access

Easy loading/unloading

Vacuum Performance

Base Pressure

≤5×10−5 Pa

 

Leak Rate

≤5×10−7 Pa·L/s

 

Pressure Rise Rate (12h)

≤10 Pa

 

Pumping System

Domestic molecular pump + mechanical pump

Targets & Power Supplies

Target Quantity & Size

3 × 2-inch magnetron targets (HV compatible)

 

Target Types

1 × Standard magnetic field, 1 × Strong magnetic field

 

Target-Substrate Distance (Multilayer)

40–120 mm

 

Target-Substrate Distance (Ion Source)

80–120 mm

 

RF Power Supply

1 × 1000 W, 13.56 MHz (auto-matching)

 

DC Power Supply

2 × 1000 W

Substrate Holder

Capacity

Up to 3 substrates

 

Rotation Speed

5–30 RPM (self-rotation + planetary)

 

Heating Range

Programmable up to 450°C

 

Bias Voltage

Supports up to 1000 V

Gas Control System

Gas Lines

2 independent MKS mass flow controllers (Ar + reactive gas)

 

Features

Gas mixing, adjustable/measurable chamber pressure

Additional Features

Chamber Baking

Infrared heating (150°C)

 

Liner Plate

Prevents chamber contamination

 

Safety Protections

Water/power failure interlock, anti-misoperation protection

Key Features & Applications

1. Advanced Deposition Capabilities

· Supports DC/RF sputtering for metals, semiconductors, and insulators.

· Triple-target design enables sequential multilayer deposition without vacuum breaks.

2. Precision Process Control

· Programmable substrate heating (±450°C) with adjustable ramp rates.

· Rotation mechanism (5–30 RPM) ensures uniform film thickness.

3. Research & Small-Batch Flexibility

· Ideal for nanoscale functional films (e.g., optoelectronics, tribological coatings).

· Reverse sputtering cleaning enhances film adhesion and purity.

4. User-Centric Design

· Manual controls for target shutters, rotation, and temperature.

· Safety systems mitigate operational risks (e.g., interlock protections).

Users

· Academic & Government Labs: Thin-film material R&D.

· Industrial Prototyping: Small-scale production of specialized coatings.

 

 Nano Sputtering Coater


 

Related Tags :

Nano Sputtering Coater RF Sputtering Equipment Triple-targets Sputtering Equipment
Home About TMAX Products FAQ News Contact Us Sitemap Blog Xml
copyright © Xiamen Tmax Battery Equipments Limited.