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Sputter Coater

High Vacuum Glove Box Metal&Non-Metal Target Sputtering Coating System

  • Model Number:

    TMAX-PC-JS02
  • Input Power:

    2000W
  • Compliance:

    CE Certified
  • Warranty:

    One Year limited warranty with lifetime support
  • Shipping Port:

    Xiamen
  • MOQ:

    1
  • Payment:

    L/C D/A D/P T/T Western Union
  • Delivery Time:

    5 days
Product Details

High Vacuum Glove Box Metal&Non-Metal Target Sputtering Coating System

 

 

Model: TMAX-PC-JS02-D-Shaped Magnetron Sputtering Coater


Main Purpose

Designed for the preparation of nano-scale single-layer and multilayer functional films, including hard coatings, metallic films, semiconductor films, dielectric films, and other advanced thin-film materials. Widely used in universities, research institutes, and small-batch production in scientific laboratories.

System Composition

· Vacuum chamber system (sputtering chamber)

· Target system

· Sample stage system

· Vacuum pumping & measurement system

· Gas flow system

· Control system

· Film thickness monitoring system

· Front-opening door mechanism

· Electrical control system

Technical Specifications

Parameter

Specification

Ultimate Vacuum

6.7×10-5 Pa

System Leak Rate

1×10-7 Pa·L/s

Vacuum Recovery Time

40 min to 6.6×10 Pa (after N2 purge)

Vacuum Chamber

D-shaped, 400 × 350 × 300 mm

Sample Stage

3" × 3", 3.2 mm thickness

Magnetron Targets

3 targets (2 standard + 1 high-strength)

Effective Sputtering Area

3" × 3"

Target Diameter

Φ50 mm (water-cooled)

Target-to-Substrate Distance

50–90 mm (adjustable)

Substrate Bias Voltage

-200 V

Sample Turntable

1 position (holds 2" substrates)

Gas Flow System

2-channel mass flow controller

Film Thickness Monitor

0–999,999 Å

Pumping Options

Turbo molecular pump or cryogenic pump + dry scroll pump

Key Features & Applications

1. High Precision & Versatility

· Suitable for research and small-scale production of high-performance thin films, including optical, electronic, and protective coatings.

· Adjustable target-substrate distance ensures optimized film uniformity.

2. Advanced Control & Monitoring

· Computerized real-time tracking of deposition parameters enhances repeatability.

· Flexible gas flow control (2-channel MFC) supports reactive and non-reactive sputtering.

3. Efficient & Reliable Vacuum System

· Fast vacuum recovery minimizes downtime.

· Dual pumping options (turbo or cryogenic) adapt to different process requirements.

4. User-Friendly Design

· D-shaped chamber & front-opening door facilitate easy sample loading.

· Optional heating expands compatibility with temperature-sensitive materials.

Ideal for:

· Academic & industrial R&D in materials science, nanotechnology, and semiconductor engineering.

· Functional film development for optics, wear resistance, and electronic devices.

· Prototype fabrication requiring high-precision, customizable coatings.

This system combineshigh deposition control, flexible configuration, and robust performance, making it a preferred choice for advanced thin-film research and development.

 Glove Box Sputtering Coating