Lab Multi-target Magnetron Sputtering System For Compound Film Deposition

Lab Multi-target Magnetron Sputtering System For Compound Film Deposition 

Model: TMAX-PD-JS04-Adjustable Multi-Target System for Metal, Oxide, and Semiconductor

Product Overview

The TMAX-PD-JS04 is a compact magnetron sputtering system designed for laboratory applications, including the deposition of metallic, oxide, dielectric, and semiconductor thin films, as well as the preparation of electrode materials for SEM sample coating. It is also suitable for educational purposes and pre-production process testing. With user-friendly operation, multifunctional capabilities, and high scalability, this system is ideal for academic research and industrial R&D.

Key Features

✔ Adjustable Co-Focal Sputtering Structure: The target gun height and angle are adjustable for optimized deposition.
✔ Stable Gas Distribution: Process gases are introduced near the target surface, ensuring uniform reaction gas concentration throughout the vacuum chamber.
✔ Flexible Control Options: Supports both manual operation (Siemens PLC + touchscreen) and fully automatic control (computer + PLC).
✔ Precise Heating & Bias Control: The substrate stage supports heating up to 500°C (accuracy: ±3°C at 200°C, ±1.5°C at 500°C) and bias voltage up to -800V.
✔ High Uniformity: Film uniformity within ±3%~±5% over a 3-inch area.

Technical Specifications

Advantages & Applications

✔ Advantages

· Co-focal sputtering design for precise film control.

· High uniformity (±3%~±5%) ensures consistent coating quality.

· Multi-functional for diverse thin-film research needs.

✔ Applications

· Academic Research: Thin-film studies, electrode fabrication, and SEM sample preparation.

· Advanced Materials: R&D in energy-related organic materials and novel processes.

This system excels in low-temperature, high-precision, and controllable thin-film deposition, making it a versatile tool for scientific and industrial innovation.