Lab DC/RF Dual-Head Vacuum 2 Inch Magnetron Plasma Sputtering Coater Machine

DC/RF Dual-Head High Vacuum 2 Inch Magnetron Plasma Sputtering Coater

Mini DC Ion Sputtering Carbon Coater Coating Machine System

Mini DC Ion Sputtering Carbon Coater Coating Machine System     Product Overview The TMAX-BY-JS02 Ion Sputtering Coater is a DC (direct current) sputtering deposition system based on a two-electrode DC sputtering principle—a simple, reliable, and cost-effective coating technology widely adopted in industrial applications. Beyond its fundamental design, the TMAX-BY-JS02 features: · A dedicated sample sputtering chamber · Vacuum gauge and sputtering current meter · Adjustable sputtering current controller · Micro vacuum valve and timer · Integrated automated circuitry for precise control of chamber pressure, ionization current, and process gas selection, ensuring optimal coating quality. Key Innovations · Durable rubber-sealed bell jar design prevents vacuum leakage and edge chipping during prolonged use. · Ceramic-sealed high-voltage electrode outperforms conventional rubber seals in longevity. · Large-capacity sputtering chamber and optimized target area ensure uniform, contaminant-free coatings. · High-stability solenoid valves and a dual-gas-path automatic control system enhance sample protection and film quality. Ideal for: · SEM sample preparation in electron microscopy labs · Electrode fabrication for R&D research Technical Specifications Parameter Details Sputtering Gas Argon, nitrogen, or other gases (selectable per experiment) Target Material Standard: Gold target (50mm × 0.1mm thick). Optional: Silver, platinum, etc. Sputtering Current Max: 50mA Deposition Rate >4nm/min Chamber Dimensions Ø160mm × 120mm (H) Sample Stage Compatible with Ø50mm and Ø70mm stages (customizable) Power Supply 220V AC (110V optional), 50Hz   Features Highlight 1. Leap Vacuum Pump: High-performance pumping for consistent vacuum levels. 2. Dual-Gas Control: Isolated gas paths safeguard sample integrity. 3. User-Centric Design: Timed sputtering, adjustable parameters, and modular stage options streamline operation. Note: Parameters are default for standard configuration. Customizations (e.g., target materials, voltage) available upon request.   html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; } html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; } html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; } html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; }

PVD DC Sputtering Coating System For Oxides & Ceramics & Semiconductors

PVD DC Sputtering Coating System For Oxides & Ceramics & Semiconductors   Model: TMAX-BY-JS09| – Product Specifications Product Overview The TMAX-BY-JS09 is a compact, high-vacuum magnetron sputtering system specifically designed for glovebox-integrated applications. Its space-saving flush-mount design allows the observation window to align perfectly with the glovebox wall, eliminating internal space occupation—a common limitation of traditional sputtering systems. Since its launch, this system has been widely adopted by research institutions for its efficiency and precision. Technical Specifications Category Specification Vacuum System Rotary vane pump (oil) + Turbo molecular pump (oil-free) Pumping Speed Rotary pump: 16 m³/h (4.4 L/s) @50Hz / 19.2 m³/h (5.2 L/s) @60Hz  Turbo pump: 300 L/s Ultimate Vacuum 5×10⁻⁵ Pa Working Pressure 0.5–5 Pa Pump-Down Time ≤10 min (to 10⁻³ Pa) Vacuum Measurement From atmosphere to 10⁻⁶ Pa Gas Control Precision gas flow controller Chamber Size φ260 mm × 200 mm (metal) Sputtering Target φ50 mm × 3 mm (Cu target); suitable for weakly magnetic materials Power Supply AC 220V 50Hz or AC 110V 60Hz Power Consumption ≤3000 W Cooling System Air cooling (pump) + Water cooling (sputtering target) Dimensions & Weight 610 mm (L) × 420 mm (W) × 490 mm (H) / ~100 kg Warranty 1-year limited warranty, lifetime technical support Key Features & Customer Benefits 1. Space-Saving Glovebox Integration · Problem Solved: Traditional sputtering systems occupy valuable glovebox space, limiting workflow efficiency. · Our Solution: The flush-mounted design minimizes protrusion, allowing seamless integration without compromising internal workspace—ideal for labs with limited glovebox capacity. 2. High-Performance Vacuum & Fast Pump-Down · Achieves 5×10⁻⁵ Pa ultimate vacuum, ensuring ultra-clean deposition conditions for sensitive materials (e.g., semiconductors, optical coatings). · Rapid pump-down (≤10 min to 10⁻³ Pa) reduces idle time, enhancing lab productivity. 3. Precision Process Control · Stable gas flow control enables repeatable deposition rates, critical for uniform thin-film growth. · Broad vacuum measurement range (atmosphere to 10⁻⁶ Pa) ensures accurate monitoring across all process stages. 4. Versatile Material Compatibility · Supports argon and other process gases for reactive/non-reactive sputtering. · Accommodates 50mm targets (Cu standard, customizable for weakly magnetic materials). 5. Reliable Cooling & Safety · Hybrid air + water cooling prevents overheating during extended operation, ensuring system longevity.       html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; }