Dual-Target PVD Sputtering Machine For Conductive And Biological Multilayer Films

Dual-Target PVD Sputtering Machine For Conductive And Biological Multilayer Films 

Model: TMAX-PC-JS06-RF&DC&MF for Conductive Multilayer Films

Technical Parameters

Key Features & Applications

1. Dual-Target Flexibility

·Supports multi-layer or composite film deposition (e.g., conductive/insulating stacks).

·RF/DC/MF compatibility enables processing of magnetic materials.

2. High Vacuum Performance

·Ultra-low base pressure (≤6.6×10⁻⁶ Pa) minimizes contamination for high-purity films.

·Fast pump-down and excellent vacuum retention reduce downtime.

3. Precision Process Control

·PID-controlled heating (RT–600°C) for annealing or stress management.

·Automated gas flow (MFC) and power adjustment for reproducible results.

4. User-Centric Design

·Rotating substrate holder ensures uniform coating (≤5% non-uniformity).

·Touchscreen + PLC automation simplifies operation and reduces human error.

5. Compact & Mobile

·Lockable wheeled frame suits lab environments with space constraints.

Ideal For:

· Research: Thin-film studies (semiconductors, optics, tribology).

· Industry: Functional coatings (wear-resistant, decorative, or barrier films).

· Magnetic Materials: Sputtering of Fe, Co, Ni alloys or oxides.