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contact us
- If you have questions, please contact us, all questions will be answered
- WhatsApp : +86 18659217588
- Email : David@tmaxcn.com
- Email : Davidtmaxcn@gmail.com
- Add : No. 39, Xinchang Road, Xinyang, Haicang Dist., Xiamen, Fujian, China (Mainland)
Glovebox Dual-Target Sputtering Coating Machine Coater For Oxides & Ceramics & Semiconductors
Model Number:
TMAX-BY-JS05Input Power:
2000WCompliance:
CE CertifiedWarranty:
One Year limited warranty with lifetime supportShipping Port:
XiamenMOQ:
1Payment:
L/C D/A D/P T/T Western UnionDelivery Time:
5 days
- WhatsApp : +86 18659217588
- Email : David@tmaxcn.com
- Email : Davidtmaxcn@gmail.com
- Wechat : 18659217588
Previous:
Versatile Magnetron Sputtering Coater For Conductive Metal Thin Film Layer DepositionNext:
High Vacuum Benchtop Magnetron Co-sputtering System Equipment
Glovebox Dual-Target Sputtering Coating Machine Coater For Oxides & Ceramics & Semiconductors
Model: TMAX-BY-JS05 – Product Specifications
1. System Overview
The TMAX-BY-JS05 is a compact, benchtop magnetron sputtering system designed for high-performance thin-film deposition in research and laboratory environments. Featuring a dual-target configuration, it supports the deposition of single or multilayer functional films, including conductive, dielectric, optical, and hard coatings. The system combines high vacuum performance, precise process control, and user-friendly operation, making it ideal for material science, semiconductor research, and advanced coating development.
2. Technical Specifications
2.1 General Parameters
Parameter |
Specification |
Model |
TMAX-BY-JS05 |
Type |
Benchtop Laboratory System |
Dimensions (W×D×H) |
610 × 420 × 490 mm |
Weight |
100 kg |
Power Supply |
AC 220V 50Hz / 110V 60Hz |
Power Consumption |
<3 kW |
Cooling Method |
Water-cooled (target) + Air-cooled (pump) |
Warranty |
1 year limited (lifetime support) |
2.2 Vacuum System
Parameter |
Specification |
Pump Configuration |
Rotary Pump (4.4 L/s) + Turbo Pump (300 L/s) |
Base Pressure |
≤5×10⁻⁵ Pa |
Working Pressure |
0.5–5 Pa |
Pump-Down Time (to 10⁻³ Pa) |
≤10 minutes |
Vacuum Measurement |
Full-range gauge (Atmosphere to 10⁻⁵ Pa) |
2.3 Deposition System
Parameter |
Specification |
Target Configuration |
Dual magnetron targets (independent control) |
Target Size |
Ø50 × 3 mm (standard: Cu & Al) |
Target Materials |
Metals, alloys, oxides, ceramics |
Magnetic Compatibility |
Weak magnetic materials supported |
Deposition Rate |
Adjustable (process-dependent) |
2.4 Process Control
Parameter |
Specification |
Gas Flow Control |
Mass flow controller (Ar/other inert gases) |
Power Supply |
DC: 0–600V, 0–1.6A; RF: 300W/500W (optional) |
Thickness Monitoring |
Real-time touchscreen control with 257 preloaded materials |
Operation Interface |
Dual-screen VPI control system |
2.5 Chamber & Substrate
Parameter |
Specification |
Chamber Material |
Stainless steel |
Chamber Dimensions |
Outer: Ø260 × 500 mm; Inner: Ø210 × 270 mm |
Substrate Holder |
Customizable (max Ø200 mm) |
3. Key Features & Benefits
· Dual-Target Flexibility: Enables co-deposition or sequential layering of dissimilar materials (e.g., metal/oxide stacks).
· High Vacuum Performance: Achieves 5×10⁻⁵ Pa base pressure for contamination-free films.
· Precision Control: Touchscreen interface with real-time thickness monitoring and gas flow regulation.
· Compact Design: Optimized for small labs with limited space.
· Material Versatility: Supports metals, oxides, polymers, and magnetic materials.
+86 13174506016
David@tmaxcn.com
