Glovebox Multi-Material Evaporator Machine For Atomic Layer Deposition & Perovskite

 Glovebox Multi-Material Evaporator Machine For Atomic Layer Deposition & Perovskite 

TMAX-ZY-DZ01-Advanced Thin-Film Deposition System

Overview

The TMAX-ZY-DZ01 Electron Beam Evaporation Coating System integrates a cryogenic pump vacuum assembly to deposit thin films via electron beam bombardment in a high-vacuum environment. Equipped with 6 electron beam evaporation sources, 2 resistive thermal evaporation sources, and a precision deposition control system, it enables rapid multilayer metal/alloy film deposition. Ideal for semiconductor fabrication, advanced research, and new material development.

Key Applications

✔ Scientific Research – High-precision thin-film deposition for experimental studies.
✔ Semiconductor Wafer Processing – Uniform coatings for microelectronics and MEMS devices.
✔ Optical Thin-Film Components – Low-defect films for lenses, filters, and laser optics.
✔ Nano/Microelectronic Devices – Ultra-thin, controlled-thickness coatings for advanced electronics.

System Advantages & Features

1. High Flexibility & Customization

· Modular design allows tailored configurations (e.g., additional evaporation sources).

· Dual evaporation modes (E-beam + resistive thermal) support diverse materials (metals, alloys, organics).

2. Superior Vacuum Performance

· Cryo-Torr 8 (1500L/s) + dry scroll pump achieves <5×10⁻⁶ Pa base pressure (≤35 min pumping time).

· VAT ISO-F200 high-vacuum valve ensures pressure stability and cryopump isolation.

3. Precision Deposition Control

· INFICON IC6 quartz crystal monitor (0.01 Å/s resolution) with dual water-cooled sensors.

· Planetary substrate rotation (0–30 RPM) ensures ≤2% thickness uniformity.

· 3 IR heaters (RT–300°C ±0.5°C) and PID-controlled cooling for thermal management.

4. Efficiency & Automation

· 3 independent substrate holders (max. 250 mm × 3) enable batch processing.

· PC+PLC+FTM control software supports 99-layer programmable recipes, real-time editing, and data export.

5. Reliability & Safety

· Telemark E-beam sources (6×7 cc crucibles, 10 kV/800 mA) ensure stable, contamination-free deposition.

· Multi-interlock protection (cooling/pressure/power failure/leak detection).

Technical Specifications

Environmental & Operational Requirements

· Temperature: 23±3°C

· Humidity: <60% RH

· Cooling Water: 0.2 MPa, ≥8 L/min

· Compressed Gas: 0.5 MPa, 80 L/min (if applicable)

Why Choose?

· Research-Grade Precision: Combines high vacuum stability with sub-nanometer thickness control.

· Multi-Material Compatibility: Handles metals (Al, Au, Ti), oxides, and organic compounds.

· Scalability: Suitable for R&D prototyping and small-batch production.

· User-Centric Design: Automated workflows reduce manual intervention while allowing parameter flexibility.

Ideal for: Universities, semiconductor labs, and optoelectronics manufacturers seeking repeatable, high-quality thin films with minimal downtime.