Lab DC/RF Magnetron Sputtering Machine Equipment For SEM

Lab DC/RF Magnetron Sputtering Machine Equipment For SEM

Model:  TMAX-PD-JS01-DC/RF Sputtering, Multi-Target, Uniform Coating (±5%), Fast Deposition

Product Overview

The TMAX-PD-JS01 is a compact magnetron sputtering system designed for laboratory-scale thin-film deposition. Compatible with both DC and RF sputtering sources, it supports the coating of metals, non-metals, and compound films (e.g., ITO). Ideal for academic and industrial research, it enables the preparation of single/multilayer films and facilitates advanced material/process development.

Key Features

1. Robust Construction

·All-stainless-steel vacuum chamber ensures durability and operational safety.

·Optimized gas path design for enhanced process control.

2. Space-Efficient & Modular

·Compact footprint (500×360×380mm) with modular expandability, maximizing lab space utilization.

3. High-Efficiency Vacuum System

·Hybrid mechanical + imported molecular pump achieves high vacuum (≤3×10⁻⁵ Pa) in 15–20 minutes, reducing downtime.

4. Precision Process Control

·Uniformity: ≤±5% over Ø80mm substrate area.

·Rotating Substrate Holder: Adjustable speed (0–20 RPM) with magnetic fluid sealing for stable deposition.

5. Flexible Configuration

·Sputtering Sources: 2–3 × 2-inch targets (DC/mid-frequency/RF).

·Gas System: 1–3 gas inlets with ±1% flow accuracy (20 sccm).

Technical Specifications

Optional Upgrades: Substrate heating/cooling, dry pump, additional flow meters, water chiller.

Target Applications

· Research: Thin-film studies (metals, oxides, semiconductors).

· Education: Lab demonstrations and student projects.

· Industry: Prototyping for electronics, optics, and energy materials (e.g., ITO for solar cells).

Why choose ?

· Fast turnaround: Rapid pump-down accelerates experimental cycles.

· Scalable: Modular design adapts to evolving research needs.

· User-centric: Intuitive controls and safety features streamline operation.