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contact us
- If you have questions, please contact us, all questions will be answered
- WhatsApp : +86 18659217588
- Email : David@tmaxcn.com
- Email : Davidtmaxcn@gmail.com
- Add : No. 39, Xinchang Road, Xinyang, Haicang Dist., Xiamen, Fujian, China (Mainland)
Metal Evaporation Coating Equipment Manufacturer For Conductive, Semiconductor, Optical Coatings
Model Number:
TMAX-PC-DZ02Input Power:
2000WCompliance:
CE CertifiedWarranty:
One Year limited warranty with lifetime supportShipping Port:
XiamenMOQ:
1Payment:
L/C D/A D/P T/T Western UnionDelivery Time:
5 days
- WhatsApp : +86 18659217588
- Email : David@tmaxcn.com
- Email : Davidtmaxcn@gmail.com
- Wechat : 18659217588
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Metal Evaporation Coating Equipment Manufacturer For Conductive, Semiconductor, Optical Coatings
TMAX-PC-DZ02-Dual-Gun Electron Beam Evaporation Coating System
Primary Applications
Designed for high-throughput deposition of conductive films, semiconductor films, ferroelectric films, optical coatings, and other advanced thin-film materials. Ideal for industrial-scale production and laboratory R&D.
System Configuration
The system consists of:
· Evaporation Chamber: U-shaped design (1200 × 9000 × 800 mm), front-loading door, rear-mounted pumping system.
· Dual E-gun Evaporation Sources: Equipped with two high-power electron guns for simultaneous or sequential deposition.
· Thermal Evaporation Electrodes: Supports resistive heating for supplementary material deposition.
· Rotating Substrate Heater: Ensures uniform film thickness distribution.
· Gas Supply System: Precision mass flow controller (MFC) for reactive or inert gas introduction.
· Vacuum System: High-efficiency pumping system with ultra-low base pressure.
· Vacuum Measurement: Real-time monitoring of chamber pressure.
· Computer Control System: Automated process control with user-friendly interface.
· Mechanical Frame: Stable and vibration-resistant structure for precision coating.
Technical Specifications
Parameter |
Specification |
Ultimate Vacuum |
≤6.7×10-4 Pa |
Pump-Down Time (1×10-5 Pa → 5×10-3 Pa) |
≤20 min |
System Leak Rate |
≤6.7×10-7Pa·L/s |
Chamber Dimensions |
1200 × 9000 × 800 mm (U-shaped, front-opening) |
Electron Guns (2 sets) |
Anode Voltage: 10 kV |
Crucible (Water-Cooled) |
24-well design, 11 ml capacity per well |
Power Output |
0–10 kW (adjustable) |
Optional Resistive Source |
Compatible with thermal evaporation materials |
Substrate Capacity |
Holds 20× 4-inch substrates per batch |
Substrate Stage |
Continuous rotation (5–60 rpm), adjustable source-to-substrate distance (350 mm) |
Heating Temperature |
Up to 400°C (±1°C accuracy) |
Gas Flow Control |
1-channel mass flow controller (MFC) |
Thickness Monitor |
Quartz Crystal Microbalance (QCM), display range: 0–99,999 Å (0–999.99 nm) |
Advantages & Applications
✔ High Deposition Rate & Uniformity – Dual e-gun design enables fast, large-area coating with excellent thickness control.
✔ Multi-Material Compatibility – Supports metals, oxides, semiconductors, and dielectrics with optional resistive heating.
✔ Precision Process Control – Automated QCM monitoring ensures repeatable film quality.
✔ Scalable Production – Optimized for batch processing with high substrate capacity.
✔ Stable Heating & Rotation – Reduces stress and improves adhesion for high-performance films.
Ideal for:
· Semiconductor & MEMS fabrication
· Optical & anti-reflective coatings
· Thin-film solar cells & sensors
· Academic & industrial research




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+86 13174506016
David@tmaxcn.com