PVD Magnetron Sputtering System For Thin Film Deposition In Research, Semiconductor Prototyping and Optical Coating

Model: Lith-SD-JS02-Sputtering System for Research Labs, Semiconductor Prototyping, and Optical Coating

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Product Overview

The Plasma Magnetron Sputtering System (Model: TMAX-SD-JS02) is a compact, user-friendly instrument designed for high-quality thin film deposition. With a quartz chamber (150 × 120 mm) and a maximum sputtering rate of 8 nm/min, it is ideal for research and small-scale production requiring precise, uniform coatings. Compatible with inert gases (Ar, N₂) and versatile metal targets (Au, Ag, Pt, etc.), this system combines efficiency with advanced operational features.

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Technical Specifications

Parameter	Specification
Quartz Chamber Size	150 × 120 mm
Sample Stage Size	70 mm (diameter)
Sputtering Area	50 mm (diameter)
Max. Vacuum Degree	5 Pa
Process Gases	Argon, Nitrogen (flow rate adjustable)
Max. Sputtering Rate	8 nm/min
Power Consumption	200 W
Dimensions (W×D×H)	360 × 310 × 150 mm
Operating Temperature	0–40°C
Relative Humidity	< 85%
Installation	Horizontal desktop placement

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Key Features & Advantages

1. Intuitive Control & Monitoring

4.3" color touchscreen with graphical interface for real-time display of sputtering current, voltage, and vacuum levels.

2. Flexible Gas & Target Options

Adjustable inert gas flow (Ar/N₂) and support for 50 mm diameter metal targets (1–2 mm thickness), enabling quick material swaps and process reproducibility.

3. Modular & User-Centric Design

·Split-type quartz chamber for easy maintenance.

·Height-adjustable sample stage (±20 mm) with rotational alignment.

·Auto-venting post-sputtering simplifies sample handling.

4. Compact & Reliable

·Space-saving footprint with multi-layered software protections for extended durability.

5. Uniform Film Quality

·Dense, homogeneous coatings compatible with noble and transition metals (Au, Ag, Pt, etc.).

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Target Applications

· Research Labs: Thin film studies, surface engineering, and material science.

· Semiconductor Prototyping: Deposition of conductive/metallic layers.

· Optics & Electronics: Functional coatings for sensors or display components.

Note: Optimized for small substrates (≤50 mm) and low-to-medium throughput requirements.