RF Magnetron Sputtering System for Metals & Non-Metals Film Deposition

Model: TMAX-SD-01-Metals & Non-Metals: Insulators, Semiconductors, Carbon-Based Thin Film Deposition

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Product Specifications

Parameter	Specification
Model	TMAX-SD-01
Type	RF Magnetron Sputtering System
Chamber Size	150 × 120 mm
Target Material	50 mm diameter (metals & non-metals, thickness: 1–2 mm)
RF Power	Adjustable (1–500 W)
RF Frequency	13.56 MHz
Matching Network	Automatic impedance matcher
Sputtering Area	50 mm
Ultimate Vacuum	5 Pa (base pressure)
Process Gases	Argon, nitrogen, and other inert gases (flow rate adjustable)
Max. Deposition Rate	8 nm/min

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Key Features & Applications

1. Versatile RF Sputtering for Metals & Non-Metals

· RF Power & Auto-Matching: 13.56 MHz RF with automatic impedance matching ensures stable sputtering of both conductive and insulating materials (e.g., oxides, ceramics).

· Broad Applications: Ideal for advanced thin-film research in semiconductors, optics, and functional coatings.

2. Precise Gas Control & High Vacuum Performance

· Adjustable Inert Gas Flow: Supports Ar, N₂, and other inert gases for controlled deposition environments.

· High Purity Deposition: Base vacuum of 5 Pa minimizes contamination, ensuring high-quality film growth.

3. User-Friendly & Efficient Operation

· Quick Target Change: Compatible with 50 mm targets (1–2 mm thick) for flexible material testing.

· Preset Process Recipes: Saves and recalls parameters for repeatable experiments and production.

4. Stable & High-Speed Deposition

· Max Deposition Rate: 8 nm/min with excellent film uniformity.

· Automated Matching: Reduces manual tuning and enhances process stability.

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Recommended Applications

✔ Research & Development: Thin-film studies for semiconductors, dielectrics, and optical coatings.
✔ Small-Scale Production: Prototyping and specialized coating applications.
✔ Multi-Material Sputtering: Supports both metallic and non-metallic targets for diverse material systems.