Lab 3 Heads 1 Inch RF Plasma Magnetron Sputtering Coater Machine with DC Magnetron Sputtering

3 Heads Compact 1 Inch RF Plasma Magnetron Sputtering Coater, with DC Magnetron Sputtering Option

2 inch RF Plasma Magnetron Sputtering Coater Machine for Non-Conductive Thin Films

2 inch  RF Plasma Magnetron Sputtering Coater for Non-Conductive Thin Films

Lab DC Magnetron Sputtering Coater Machine with Rotary Stage & Water Chiller

High Power DC Magnetron Sputtering Coater w Rotary Stage & Water Chiller

Lab DC Magnetron Sputtering Coater Machine With Target for Noble Metal Coating

Compact DC Magnetron Sputtering Coater With Gold Target for Noble Metal Coating

Lab Powder PVD Coater Machine with DC Magnetron Sputtering & Vibration Stage

Compact Powder PVD Coater with DC Magnetron Sputtering & Vibration Stage

5 Heads RF Plasma Magnetron Sputtering Coater Machine for MGI Thin Film Research

Customized 5 Heads RF Plasma Magnetron Sputtering Coater for MGI Thin Film Research

Lab DC/RF Dual-Head Vacuum 2 Inch Magnetron Plasma Sputtering Coater Machine

DC/RF Dual-Head High Vacuum 2 Inch Magnetron Plasma Sputtering Coater

Lab 4.3-inch Full-color Touch Screen Vacuum Benchtop Magnetron Sputtering Machine Used in Fabrication of Perovskite Solar Cells

Sales Manager: Gia Email: Gia@tmaxlaboratory.com Wechat: Dingqiuna Whatsapp：+86 131 7450 6016 Skype: gia@tmaxcn.com

Vacuum Magnetron Ion Sputtering Coater Optional Water Cooling Used to Coat Non-conductive Or Heat-sensitive SEM Samples

Sales Manager: Gia Email: Gia@tmaxlaboratory.com Wechat: Dingqiuna Whatsapp：+86 131 7450 6016 Skype: gia@tmaxcn.com

RF Magnetron Sputtering System for Metals & Non-Metals Film Deposition

RF Magnetron Sputtering System for Metals & Non-Metals Film Deposition     Model: TMAX-SD-01-Metals & Non-Metals: Insulators, Semiconductors, Carbon-Based Thin Film Deposition Product Specifications Parameter Specification Model TMAX-SD-01 Type RF Magnetron Sputtering System Chamber Size 150 × 120 mm Target Material 50 mm diameter (metals & non-metals, thickness: 1–2 mm) RF Power Adjustable (1–500 W) RF Frequency 13.56 MHz Matching Network Automatic impedance matcher Sputtering Area 50 mm Ultimate Vacuum 5 Pa (base pressure) Process Gases Argon, nitrogen, and other inert gases (flow rate adjustable) Max. Deposition Rate 8 nm/min Key Features & Applications 1. Versatile RF Sputtering for Metals & Non-Metals · RF Power & Auto-Matching: 13.56 MHz RF with automatic impedance matching ensures stable sputtering of both conductive and insulating materials (e.g., oxides, ceramics). · Broad Applications: Ideal for advanced thin-film research in semiconductors, optics, and functional coatings. 2. Precise Gas Control & High Vacuum Performance · Adjustable Inert Gas Flow: Supports Ar, N₂, and other inert gases for controlled deposition environments. · High Purity Deposition: Base vacuum of 5 Pa minimizes contamination, ensuring high-quality film growth. 3. User-Friendly & Efficient Operation · Quick Target Change: Compatible with 50 mm targets (1–2 mm thick) for flexible material testing. · Preset Process Recipes: Saves and recalls parameters for repeatable experiments and production. 4. Stable & High-Speed Deposition · Max Deposition Rate: 8 nm/min with excellent film uniformity. · Automated Matching: Reduces manual tuning and enhances process stability. Recommended Applications ✔ Research & Development: Thin-film studies for semiconductors, dielectrics, and optical coatings. ✔ Small-Scale Production: Prototyping and specialized coating applications. ✔ Multi-Material Sputtering: Supports both metallic and non-metallic targets for diverse material systems.       html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; }

High Vacuum Benchtop Magnetron Co-sputtering System Equipment

High Vacuum Benchtop Magnetron Co-sputtering System Equipment    TMAX-BY-JS04-Various weakly magnetic targets Specification Category Specification Target Material Various weakly magnetic targets Target Size Ø60-80mm (weakly magnetic targets) Control Mode Manual operation Chamber Borosilicate glass, Ø180mm × H240mm Sample Stage Ø180mm (compatible with Ø80mm stage) Sputtering Gas Supports multiple gases (e.g., Ar) Vacuum System - Turbo molecular pump (80L/s)   - Two-stage high-performance vacuum pump Sputtering Targets - Standard: Au (60mm × 0.1mm)   - Optional: Ag, Pt (customizable) Sputtering Current 0-500A Ultimate Vacuum 5×10⁻⁴ Pa Operating Voltage 220V, 50Hz Key Features & Applications Features: ✔ High Deposition Rate – Enhanced plasma confinement for efficient material utilization. ✔ Low Substrate Heating – Minimized thermal impact on sensitive materials. ✔ Compact Benchtop Design – Ideal for lab-scale thin-film research. ✔ Flexible Target Options – Supports Au, Ag, Pt, and other weakly magnetic materials. Typical Applications: · Semiconductors & Microelectronics – Conductive layers, MEMS, sensors. · Optical Coatings – Reflective/anti-reflective films. · Material Science – Nanostructured thin films, surface engineering.   html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; 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High-Precision PVD Magnetron Sputtering & Thermal Evaporation Carbon Coating Machine

High-Precision PVD Magnetron Sputtering & Thermal Evaporation Carbon Coating Machine     Dual-function SEM Sample Preparation Instrument 1. Technical Specifications Vacuum System Parameter Specification Rotary Pumping Speed 50 Hz: 8 m³/h (2.2 L/s) / 60 Hz: 9.6 m³/h (2.6 L/s) Vacuum Limit 2 Pa Max Sputtering Current 100 mA Max Evaporation Current 100 A Sputtering Working Pressure 20 Pa – 8 Pa Evaporation Working Pressure 6 Pa – 4 Pa Working Vacuuming Time < 5 min (to 2 Pa) Vacuum Measurement Atmosphere to 2×10 mbar Gas Control Gas Flow Controller Chamber Size Ø150 × 120 mm (height), scratch-resistant quartz glass Magnetron Target Source Ø50 × 0.1 mm (Au) / Optional: Au, Ag, Pt Evaporation Target Source Carbon Rope Operation Method Manual (instruction manual included) Dimensions (Main Unit) 360 mm (L) × 300 mm (W) × 380 mm (H) Dimensions (Evaporation Unit) 360 mm (L) × 300 mm (W) × 160 mm (H) Weight 55 kg Power Supply AC 110V 60Hz or AC 220V 50Hz Power Consumption < 2000 W Cooling Method Air Cooling (Evaporation) + Water Cooling (Sputtering) Warranty 1-year limited warranty with lifetime product support Sputtering Parameters · Sputtering Targets: Au (standard), optional Ag, Pt, Cr, Al, Cu · Target Size: Ø50 mm · Sample Stage: Adjustable height, accommodates Ø50 mm and Ø70 mm samples (customizable) · Sputtering Voltage: 0–1600 V (DC, adjustable) · Sputtering Current: 0–50 mA · Sputtering Time: 0–360 s Evaporation Parameters · Evaporation Material: Carbon fiber rope · Evaporation Current: 0–100 A (AC) · Evaporation Voltage: 0–30 V · Evaporation Time: 0–1 s · Micro Vacuum Valve: Compatible with Ø3 mm tubing General · Input Voltage: 220 V (110 V optional), 50 Hz · Vacuum Pump: 2 L/s rotary vane pump (domestic VRD-8) 2. Key Features Dual-Function Advantages · Integrated Design: Combines metal sputtering and carbon evaporation in one compact system · Process Flexibility: Switch between conductive metal coatings (Au/Ag/Pt) and ultra-thin carbon films · Time Efficiency: 5-minute pump-down enables rapid sample processing User-Centric Design · Transparent chamber for real-time monitoring · Ergonomic controls with preset programs · Tool-free target replacement system html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; 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SEM Low-Temperature Mini Magnetron Sputtering System For Au, Ag, Al, Metal

SEM Low-Temperature Mini Magnetron Sputtering System For Au, Ag, Al, Metal      Glovebox-Compatible SEM Sample Coater for Beam-Sensitive Materials 1. System Overview ✔ Non-conductive sample coating (Au/Ag/Pt) for SEM imaging ✔ Temperature-sensitive substrates (<60°C process temp) ✔ High-quality thin film deposition with minimized thermal damage 2.  Core parameter Parameter Specification Ultimate Vacuum 4×10⁻² mbar Base Vacuum 1 Pa Pump Down Time <1 minute Vacuum Pump Rotary Vane (2 L/s, Oil-lubricated) Vacuum Measurement Mechanical Gauge (Atmosphere-10⁻² mbar) 3. Cold Sputtering Technology: Patented magnetic confinement reduces substrate heating 4. Glovebox-Adaptable: Optional configuration for inert atmosphere processing Parameter Specification Model TMAX-BY-JS08 Sputtering Type DC Magnetron (Physical Vapor Deposition) Target Materials (Standard) Au (50mmØ×0.1mm) Optional Target Materials Ag, Pt, Cr Maximum Substrate Size Ø70mm (customizable) Chamber Material Borosilicate Glass (160mmØ×120mmH) System Dimensions (W×D×H) 300×360×380 mm Weight 28 kg    

RF+DC Magnetron Ion Sputtering Coater Coating Machine For Non-Metals, Oxide, Ceramics

RF+DC  Magnetron Ion Sputtering Coater Coating Machine For Non-Metals, Oxide, Ceramics     Model: TMAX-BY-JS12| – Product Specifications Technical Specifications Parameter Specification Vacuum Pump System Rotary Vane Pump (Oil-lubricated) + Oil-Free Turbo Molecular Pump Set Rotary Pump Speed 50Hz: 16m³/h (4.4 L/s) | 60Hz: 19.2m³/h (5.2 L/s) Molecular Pump Speed 300 L/s Ultimate Vacuum 5 × 10⁻⁴ Pa Working Pressure 0.5 – 5 Pa Pump-Down Time >10 min (to 10 Pa) Vacuum Measurement Range: Atmosphere to 10⁻⁴ Pa Gas Control Mass Flow Controller (MFC) Chamber Size φ260mm × 200mm (Metal Chamber) Magnetron Target Source Target Size: φ50mm × 3mm (Copper)  Compatible with Weakly Magnetic Materials Operation Method Manual Control (Instruction Manual Provided) Weight / Dimensions 100kg / 610mm (L) × 420mm (W) × 490mm (H) Power Supply AC 110V 60Hz or AC 220V 50Hz Power Consumption <3000W Cooling System Air Cooling (Pump) + Water Cooling (Sputtering Target) Warranty 1-Year Limited Warranty with Lifetime Technical Support Key Features & Applications Core Advantages 1. Multi-Mode Sputtering Supports RF (Radio Frequency), DC (Direct Current), and RF+DC Hybrid modes for conductive, insulating, and composite material coatings. 2. High Vacuum Stability Turbo molecular pump (300 L/s) combined with a rotary pump ensures an ultimate vacuum of 5×10⁻⁴ Pa, guaranteeing high-purity and uniform films. 3. Flexible Compatibility ·Chamber size (φ260mm × 200mm) accommodates small to medium-sized samples. ·φ50mm target supports copper and weakly magnetic materials for diverse applications. 4. Efficient Cooling System ·Water-cooled target minimizes thermal load during high-power sputtering. · Air-cooled pump reduces maintenance costs for continuous operation. Typical Applications ·Research Fields Thin film deposition, nanostructured coatings, semiconductor device development. ·Industrial Uses Optical coatings, wear-resistant layers, surface modification of electronic components.       html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; } html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; } html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; }