High-Precision PVD Magnetron Sputtering & Thermal Evaporation Carbon Coating Machine

High-Precision PVD Magnetron Sputtering & Thermal Evaporation Carbon Coating Machine

Dual-function SEM Sample Preparation Instrument

1. Technical Specifications

Vacuum System

Sputtering Parameters

· Sputtering Targets: Au (standard), optional Ag, Pt, Cr, Al, Cu

· Target Size: Ø50 mm

· Sample Stage: Adjustable height, accommodates Ø50 mm and Ø70 mm samples (customizable)

· Sputtering Voltage: 0–1600 V (DC, adjustable)

· Sputtering Current: 0–50 mA

· Sputtering Time: 0–360 s

Evaporation Parameters

· Evaporation Material: Carbon fiber rope

· Evaporation Current: 0–100 A (AC)

· Evaporation Voltage: 0–30 V

· Evaporation Time: 0–1 s

· Micro Vacuum Valve: Compatible with Ø3 mm tubing

General

· Input Voltage: 220 V (110 V optional), 50 Hz

· Vacuum Pump: 2 L/s rotary vane pump (domestic VRD-8)

2. Key Features

Dual-Function Advantages

· Integrated Design: Combines metal sputtering and carbon evaporation in one compact system

· Process Flexibility: Switch between conductive metal coatings (Au/Ag/Pt) and ultra-thin carbon films

· Time Efficiency: 5-minute pump-down enables rapid sample processing

User-Centric Design

· Transparent chamber for real-time monitoring

· Ergonomic controls with preset programs

· Tool-free target replacement system