RF Magnetron Sputtering System for Metals & Non-Metals Film Deposition

RF Magnetron Sputtering System for Metals & Non-Metals Film Deposition     Model: TMAX-SD-01-Metals & Non-Metals: Insulators, Semiconductors, Carbon-Based Thin Film Deposition Product Specifications Parameter Specification Model TMAX-SD-01 Type RF Magnetron Sputtering System Chamber Size 150 × 120 mm Target Material 50 mm diameter (metals & non-metals, thickness: 1–2 mm) RF Power Adjustable (1–500 W) RF Frequency 13.56 MHz Matching Network Automatic impedance matcher Sputtering Area 50 mm Ultimate Vacuum 5 Pa (base pressure) Process Gases Argon, nitrogen, and other inert gases (flow rate adjustable) Max. Deposition Rate 8 nm/min Key Features & Applications 1. Versatile RF Sputtering for Metals & Non-Metals · RF Power & Auto-Matching: 13.56 MHz RF with automatic impedance matching ensures stable sputtering of both conductive and insulating materials (e.g., oxides, ceramics). · Broad Applications: Ideal for advanced thin-film research in semiconductors, optics, and functional coatings. 2. Precise Gas Control & High Vacuum Performance · Adjustable Inert Gas Flow: Supports Ar, N₂, and other inert gases for controlled deposition environments. · High Purity Deposition: Base vacuum of 5 Pa minimizes contamination, ensuring high-quality film growth. 3. User-Friendly & Efficient Operation · Quick Target Change: Compatible with 50 mm targets (1–2 mm thick) for flexible material testing. · Preset Process Recipes: Saves and recalls parameters for repeatable experiments and production. 4. Stable & High-Speed Deposition · Max Deposition Rate: 8 nm/min with excellent film uniformity. · Automated Matching: Reduces manual tuning and enhances process stability. Recommended Applications ✔ Research & Development: Thin-film studies for semiconductors, dielectrics, and optical coatings. ✔ Small-Scale Production: Prototyping and specialized coating applications. ✔ Multi-Material Sputtering: Supports both metallic and non-metallic targets for diverse material systems.       html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; }