Vacuum Evaporation PVD System Machine For Metal, OLEDs, Organic 

 

TMAX-QH-ZD02-High-Vacuum Multi-Material Evaporation

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Technical Specifications

No.	Parameter	Description
1	Ultimate Vacuum	≤4×10⁻⁵ Pa (new equipment)
2	Leak Rate	6.7×10⁻⁸ Pa·L/S
3	Working Vacuum	5×10⁻⁴ Pa (Time to reach from atmosphere: <30 min, cold state with glovebox integration)
4	Pressure Holding	≤2 Pa after 12 hours (post pump shutdown)
5	Sample Size	130×130 mm (16× 25×25 mm samples; includes 2 sets)
6	Sample Holder Size	146×146 mm
7	Source-Substrate Distance	320 mm
8	Sample Rotation	0–30 RPM (water-cooled)
9	Evaporation Sources	4× metal + 4× organic sources (2 organic sources on inner/outer door, 2 metal sources on each side)
10	Substrate Lift	Fixed (non-adjustable)
11	Chamber Access	Manual front-opening door
12	Thickness Probes	4× water-cooled probes (above sources)
13	Mask Storage	Optional
14	Sample Loading	Side-insertion
15	Deposition Control	Auto rate/power/temperature control
16	Pumping System	Automated vacuum sequencing
17	Film Uniformity	±5% (for 100 nm films)
18	Safety Features	Anti-implosion, auto gas refill, environmental thermocouple

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Key Features

1. High-Precision Deposition Control

· Automated Rate/Power/Temperature Control: Ensures repeatable thin-film growth for research and small-scale production.

· Real-Time Thickness Monitoring (4× Probes): Enables accurate multilayer deposition with ±5% uniformity.

· Dual-Source Configuration (4 Metal + 4 Organic): Supports co-evaporation for advanced materials like perovskites and organic semiconductors.

2. Optimized for Efficiency & Stability

· Fast Pump-Down (<30 min to 5×10⁻⁴ Pa): Reduces downtime between batches, improving lab productivity.

· Low Leak Rate (6.7×10⁻⁸ Pa·L/S): Maintains ultra-high vacuum integrity for sensitive processes.

· Long-Term Pressure Holding (≤2 Pa after 12 hours): Minimizes re-pumping time for multi-step experiments.

3. User-Friendly Design

· Side-Loading & Front-Opening Chamber: Compatible with glovebox workflows, reducing contamination risks.

· Water-Cooled Sample Rotation (0–30 RPM): Enhances film homogeneity while preventing thermal damage.

· Optional Mask Storage: Enables patterned deposition for micro/nanofabrication.

4. Robust Safety Protections

· Anti-Implosion Design: Safeguards against chamber breaches during high-vacuum operation.

· Auto Gas Refill & Environmental Thermocouple: Protects samples and equipment during reactive material handling.

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Application Areas

1. Advanced Optoelectronic Research

· OLEDs & Organic Electronics: Precise co-evaporation of metal-organic layers for emissive devices.

· Perovskite Solar Cells: Uniform thin-film deposition for high-efficiency photovoltaic research.

· Quantum Dots & 2D Materials: Controlled growth of nanoscale films for photonics and sensors.

2. Industrial Thin-Film Development

· Barrier Coatings: Ultra-thin encapsulation layers for flexible electronics.

· MEMS & Sensors: High-purity metal/oxide deposition for microfabrication.

· Optical Coatings: Low-defect films for lenses, mirrors, and filters.

3. Customizable for Specialized Needs

· In-Situ Monitoring Upgrades: Additional diagnostics (e.g., RHEED, quartz crystal microbalance) available.

· Multi-Source Expansion: Accommodates complex material stacks (e.g., ternary systems).

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Why Choose This System?

✔ Lab-Optimized Throughput: Balances high sample capacity (16×25 mm substrates) with research-grade precision.

✔ Glovebox-Compatible: Ideal for air-sensitive materials like lithium or reactive organics.

✔ Future-Ready Design: Modular options support evolving thin-film R&D demands.