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Sputter Coater for SEM Sample Preparation

Lab Physical Vapor Deposition Coating Equipment Thin Film Evaporator

  • Model Number:

    TMAX-PD-ZD04
  • Input Power:

    2000W
  • Compliance:

    CE Certified
  • Warranty:

    One Year limited warranty with lifetime support
  • Shipping Port:

    Xiamen
  • MOQ:

    1
  • Payment:

    L/C D/A D/P T/T Western Union
  • Delivery Time:

    5 days
Product Details

Lab Physical Vapor Deposition Coating Equipment Thin Film Evaporator 

 

TMAX-PD-ZD03-Thin Film Evaporator


Product Overview

The TMAX-PD-ZD03 system adopts an oil-free high-vacuum system with a large pumping-speed molecular pump, featuring an integrated electromechanical design for minimal lab space occupancy. It supports compatible metal and organic evaporation sources, offering high cost-effectiveness and user-friendly operation. Ideal for research institutes, electrode deposition, SEM sample preparation, and studies in OLED/solar cell technologies.


Key Features

1. Broad Application Scope

Optimized for evaporating noble metals (e.g., Au, Ag) in electrode preparation and semiconductor lift-off processes, reducing material waste.

2. Space-Saving & Durable

Compact footprint (550×900 mm) with a full stainless-steel vacuum chamber for enhanced durability and safety.

3. High-Efficiency Vacuum System

Oil-free molecular pump (≥300 L/s pumping speed) allows flexible installation angles, shortened pumping paths, and faster processing.

4. Multi-Source Compatibility

Configurable with 2–4 evaporation sources (metal/organic), supporting co-evaporation or sequential deposition.

5. Precision Control

Constant-current evaporation power supply, in-situ thickness monitoring, and excellent film uniformity (±3–5%) with high repeatability.

6. Upgradability

Optional non-stop venting and full automation control.


Technical Specifications

Core Parameters

Category

Specification

Chamber Dimensions (L×W×H)

300 × 300 × 450 mm (customizable height)

System Dimensions (L×W×H)

530 × 750 × 1800 mm (standard) / 1100 × 750 × 1500 mm (alternative)

Ultimate Vacuum

≤5×10−5 Pa

Base Pressure Holding

≤5 Pa (12 hrs), ≤8×10−4 Pa (30 min)

Substrate Stage

≤100 × 100 mm (max. 110 mm substrate or 25×15 mm ITO glass)

Source-Substrate Distance

>300 mm

Evaporation Sources

· Metal Sources: 2–3 groups (optional)

· Organic Sources: Beam-source furnace type, temperature-controlled (0–500°C), integrated adjustable baffle (0–15°), 2–3 groups (optional).

Power Requirements

· Voltage: AC 220 V/50 Hz (380 V optional)

· Power: ≤6 kW


Target Applications

· Research & Academia: Electrode deposition, SEM/TEM sample preparation.

· Advanced Materials: OLED encapsulation, perovskite solar cell R&D.

· Semiconductor: Metal lift-off processes, thin-film device fabrication.

Why Choose?

· Cost-Effective: Reduced material consumption and energy-efficient operation.

· User-Centric: Simplified controls, robust safety features, and modular upgrades.

· Future-Ready: Adaptable to evolving lab needs with optional automation.

 

Physical Vapor Deposition 

Thin Film Evaporator