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Lab Physical Vapor Deposition Coating Equipment Thin Film Evaporator
Model Number:
TMAX-PD-ZD04Input Power:
2000WCompliance:
CE CertifiedWarranty:
One Year limited warranty with lifetime supportShipping Port:
XiamenMOQ:
1Payment:
L/C D/A D/P T/T Western UnionDelivery Time:
5 days
- WhatsApp : +86 18659217588
- Email : David@tmaxcn.com
- Email : Davidtmaxcn@gmail.com
- Wechat : 18659217588
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Lab Physical Vapor Deposition Coating Equipment Thin Film Evaporator
TMAX-PD-ZD03-Thin Film Evaporator
Product Overview
The TMAX-PD-ZD03 system adopts an oil-free high-vacuum system with a large pumping-speed molecular pump, featuring an integrated electromechanical design for minimal lab space occupancy. It supports compatible metal and organic evaporation sources, offering high cost-effectiveness and user-friendly operation. Ideal for research institutes, electrode deposition, SEM sample preparation, and studies in OLED/solar cell technologies.
Key Features
1. Broad Application Scope
Optimized for evaporating noble metals (e.g., Au, Ag) in electrode preparation and semiconductor lift-off processes, reducing material waste.
2. Space-Saving & Durable
Compact footprint (550×900 mm) with a full stainless-steel vacuum chamber for enhanced durability and safety.
3. High-Efficiency Vacuum System
Oil-free molecular pump (≥300 L/s pumping speed) allows flexible installation angles, shortened pumping paths, and faster processing.
4. Multi-Source Compatibility
Configurable with 2–4 evaporation sources (metal/organic), supporting co-evaporation or sequential deposition.
5. Precision Control
Constant-current evaporation power supply, in-situ thickness monitoring, and excellent film uniformity (±3–5%) with high repeatability.
6. Upgradability
Optional non-stop venting and full automation control.
Technical Specifications
Core Parameters
Category |
Specification |
Chamber Dimensions (L×W×H) |
300 × 300 × 450 mm (customizable height) |
System Dimensions (L×W×H) |
530 × 750 × 1800 mm (standard) / 1100 × 750 × 1500 mm (alternative) |
Ultimate Vacuum |
≤5×10−5 Pa |
Base Pressure Holding |
≤5 Pa (12 hrs), ≤8×10−4 Pa (30 min) |
Substrate Stage |
≤100 × 100 mm (max. 110 mm substrate or 25×15 mm ITO glass) |
Source-Substrate Distance |
>300 mm |
Evaporation Sources
· Metal Sources: 2–3 groups (optional)
· Organic Sources: Beam-source furnace type, temperature-controlled (0–500°C), integrated adjustable baffle (0–15°), 2–3 groups (optional).
Power Requirements
· Voltage: AC 220 V/50 Hz (380 V optional)
· Power: ≤6 kW
Target Applications
· Research & Academia: Electrode deposition, SEM/TEM sample preparation.
· Advanced Materials: OLED encapsulation, perovskite solar cell R&D.
· Semiconductor: Metal lift-off processes, thin-film device fabrication.
Why Choose?
· Cost-Effective: Reduced material consumption and energy-efficient operation.
· User-Centric: Simplified controls, robust safety features, and modular upgrades.
· Future-Ready: Adaptable to evolving lab needs with optional automation.




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