PVD Thermal Evaporator Coating System Metal Deposition Coater For Thin Film 

TMAX-ZY-ZD02-Research-Grade Thin Film Deposition Equipment

System Overview

TMAX-ZY-ZD02 benchtop resistive thermal evaporation coating system integrates a turbo-molecular pump vacuum assembly to achieve high-vacuum thin film deposition. Equipped with 4 evaporation sources and a precision thickness control system, it is optimized for rapid multi-layer metal/alloy deposition. Featuring a plug-and-play design, this compact instrument operates reliably in office or lab environments without specialized infrastructure, making it ideal for R&D and small-batch production.

Key Advantages

1. Portability & Flexibility

·Compact footprint with multi-environment adaptability (lab/office).

2. User-Centric Design

·One-touch operation with preloaded parameters (100+ metal deposition recipes).

·10" touchscreen for intuitive process control and real-time monitoring.

3. High-Performance Deposition

·4-source simultaneous evaporation (supports 99 layers of metals/alloys/polymers per run).

·Quartz crystal monitoring for nanometer-level thickness accuracy (±3% uniformity).

4.Premium Components

·All-aluminum chamber for efficient heat dissipation.

·Imported turbo-molecular pump (300L/s) ensures ≤6×10⁻⁵ Pa ultimate vacuum.

5.Low Maintenance

·Minimal training required; modular design simplifies servicing.

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Typical Applications

· Thin-film material research (metals/dielectrics)

· Optical coatings & nanoelectronics

· Thin-film sensors & MEMS devices

· Custom alloy/polymer multilayer structures

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Standard Specifications

Component	Details
Chamber	400×350×360mm (H), CNC-machined aluminum
Vacuum System	300L/s turbo pump + dual-stage rotary vane pump
Vacuum Measurement	Full-range gauge (atmosphere to UHV)
Evaporation Sources	4 independent thermal sources (cross-contamination-free)
Power Supply	DC power for multi-layer deposition
Thickness Control	Quartz crystal monitor + manual/auto mode switching
Software	Network-upgradable with remote parameter adjustment

Optional:

· Co-evaporation kit for alloys

· 2" substrate heater (400°C max)

· Water-cooled rotating sample stage

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Technical Parameters

· Ultimate Vacuum: ≤6×10⁻⁵ Pa (after bake-out)

· Leak Rate: ≤5.0×10⁻⁹ Pa·L/s

· Deposition Rate: ≥8 nm/min (varies by material)

· Thickness Uniformity: ≤3% (with planetary rotation)

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Site Requirements

Parameter	Specification
Dimensions	600×720×1200mm (H)
Weight	85 kg
Environment	23±3°C, <60% RH
Power	AC 230V, 32A, 50Hz
Cooling Water	0.2MPa, 15–25°C, ≥8L/min (optional)
Gas Supply	99.9% N2 (optional for venting)

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Operational Workflow

· Fully automated process: Pre-programmed vacuum pumping, substrate heating, and evaporation.

· Multi-layer capability: Sequential deposition of 4 materials (up to 99 layers) with customizable thickness/time modes.

· Data export: Real-time parameter logging and remote monitoring.

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Why Choose?

· Time-saving: Eliminates complex setup with industry-leading uptime.

· Precision: Combines lab-grade vacuum performance with production-level repeatability.

· Scalability: Modular options cater to evolving research needs.

Ideal for academic labs, startups, and industrial R&D requiring rapid prototyping of advanced thin films.