Versatile Magnetron Sputtering System For Functional Metal Film Deposition Coating

Versatile Magnetron Sputtering System For Functional Metal Film Deposition Coating  

Model: TMAX-PC-JS01- Versatile Magnetron Sputtering System For Functional Film Deposition Coating

Application:
Designed for the preparation of nanoscale single-layer and multilayer functional films, including hard coatings, metallic films, semiconductor films, and dielectric films. It is widely suitable for scientific research and small-batch production in universities and research institutes. Equipped with an anode-layer ion source for pre-cleaning and assisted deposition, as well as a reverse sputtering function to enhance film quality and adhesion.

System Configuration:
The system consists of a sputtering vacuum chamber, permanent magnet sputtering targets (3 targets), a single-substrate heating stage, DC/RF power supplies, gas supply system, pumping system, vacuum measurement, electrical control system, and mounting platform.

Technical Specifications

Key Features & Suitability

1. Precision Deposition

·Supports DC/RF sputtering for diverse materials (metals, semiconductors, dielectrics).

·Ion-assisted deposition enhances film density and adhesion.

2. High Vacuum Stability

·Ultra-low base pressure (≤5×10⁻⁶ Pa) ensures contamination-free films.

·Low leak rate maintains consistent process conditions.

3. User-Centric Design

·Vertical loading simplifies sample handling.

·Programmable substrate heating (up to 450°C) for optimized film growth.

4. Quality Assurance

·≤5% thickness uniformity and rigorous adhesion standards (tape test).

·Reverse sputtering and ion source for pre-deposition cleaning.

5. Research & Small-Batch Production

·Ideal for universities, labs, and industrial R&D in optics, electronics, and coatings.