4-Target Multilayer Film Metal PVD Sputtering Deposition System

4-Target Multilayer Film Metal PVD Sputtering Deposition System  

Model: TMAX-PC-JS05-Target Multi-Mode Sputtering (DC + RF + Strong Magnetic Field)

Technical Parameters

Key Features & Suitability Analysis

1. Precision Deposition for Advanced Films

· Nanoscale control: Achieves ≤5% thickness uniformity for functional films (e.g., semiconductors, hard coatings).

· Multi-material flexibility: Simultaneously supports metals (Cu/Al), dielectrics (PTFE), and compounds via 4 targets.

2. Enhanced Process Stability

· Ion-assisted deposition improves film adhesion and density.

· Pre-sputtering cleaning ensures contamination-free substrates.

3. User-Friendly Operation

· Automated PC control simplifies complex processes (e.g., multilayer deposition).

· Horizontal chamber design enables quick sample loading.

4. Industrial & Research Versatility

· R&D labs: Ideal for prototyping optical, electronic, or wear-resistant coatings.

· Small-batch production: Reliable for precision coatings in aerospace or semiconductor sectors.

5. Safety & Maintenance

· Liner plates protect chamber walls, reducing maintenance downtime.

· Interlocks prevent damage from operational errors.

Summary: This excels in high-repeatability, multi-material deposition, and automation, catering to both cutting-edge research and specialized industrial coating needs.

Why Choose?

1. 4-Target Multi-Mode Sputtering (DC + RF + Strong Magnetic Field)

· Unique Feature: Only system in its class offering 3 standard-field targets + 1 strong-field target in a compact design.

· Competitor Comparison: Most systems provide only DC or RF targets separately, limiting material compatibility.

· Client Benefit: Enables simultaneous deposition of metals, insulators, and alloys (e.g., Cu+Al₂O₃+Ni) without breaking vacuum.

2. Ultra-High Vacuum with Rapid Recovery (<100 min to 5×10⁻⁴ Pa)

· Unique Feature: Patented bypass pumping + dry nitrogen venting reduces pump-down time by 40% vs. industry average.

· Competitor Comparison: Comparable systems often require 3+ hours to reach working vacuum after venting.

· Client Benefit: Dramatically improves throughput for batch processing (e.g., 8–10 runs/day vs. 4–5 with competitors).

3. Integrated Ion-Assisted Deposition (IAD) for Superior Film Quality

· Unique Feature: Built-in anode-layer ion source for in-situ cleaning + energy-enhanced deposition.

· Competitor Comparison: Most systems require external ion guns (added cost/complexity).

· Client Benefit: Achieves >2x better adhesion (passes 10+ tape tests vs. industry-standard 3) and denser films for optical/barrier coatings.