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Sputter Coater for SEM Sample Preparation

Cold Magnetron Sputtering Deposition System For Conductive Coating Of SEM Sample Preparation

  • Model Number:

    TMAX-JY-JS02
  • Input Power:

    2000W
  • Compliance:

    CE Certified
  • Warranty:

    One Year limited warranty with lifetime support
  • Shipping Port:

    Xiamen
  • MOQ:

    1
  • Payment:

    L/C D/A D/P T/T Western Union
  • Delivery Time:

    5 days
Product Details

Cold Magnetron Sputtering Deposition System For Conductive Coating Of SEM Sample Preparation 

 

 

Model: TMAX-JY-JS02-Cold Magnetron Sputtering Deposition System


Product Description

The TMAX-JY-JS02 is a benchtop cold magnetron sputtering coating system equipped with a standard rotating/tilting sample stage. It is specifically designed for high-quality conductive coating of non-conductive samples with varied surface morphologies for SEM imaging. It also meets the requirements for electrode coating, semiconductor materials, and other thin-film applications.

Key Features

· "Ultra-Cold" Sputtering: Utilizes a high-efficiency, low-voltage DC magnetron source to prevent thermal damage to sensitive samples.

· Wide-Angle Coverage: Innovative magnetron design ensures uniform coating coverage, even for closely positioned samples.

· Fast Operation: Independent solenoid valves for venting, purging, and exhaust enable rapid system cycling.

· Stable Coating Performance: Precisely controlled sputtering current ensures consistent deposition rates and optimal coating quality, unaffected by chamber pressure.

· Multi-Material Compatibility: Supports various metal targets (Pt standard, optional Au, Au/Pd, or Pt/Pd) with quick and easy target replacement.

Technical Specifications

Sputtering System

Parameter

Specification

Target Material

Standard: Pt (57mm diameter × 0.1mm thickness) 

Optional: Au, Au/Pd, Pt/Pd

Sample Stage Rotation

0–60 rpm (continuously adjustable)

Sample Stage Tilt

-45° to +45° (continuously adjustable)

Stage Diameter

40mm (holds 4 standard sample holders; custom sizes available)

Sputtering Current

Microprocessor-controlled (0–99 mA) with safety interlock

Vacuum Range

Atm ~3 Pa

Control Method

Programmable (1–999s) with Start/Pause buttons; automatic pumping/sputtering/venting

Vacuum Pump

Parameter

Specification

Pumping Speed

133 L/min

Ultimate Vacuum

0.05 Pa

Noise Level

56 dB

Applications & Advantages

· Ideal for SEM Sample Preparation: Ensures high-conductivity coatings without thermal damage, critical for delicate or heat-sensitive materials.

· Versatile Material Deposition: Suitable for Pt, Au, and alloy coatings in semiconductor, nanotechnology, and materials research.

· User-Friendly Operation: Automated processes and ergonomic design enhance efficiency and reproducibility.

· Compact & Reliable: Benchtop design saves lab space while delivering professional-grade performance.

 

Sputtering Deposition System

Magnetron Sputtering Deposition