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- If you have questions, please contact us, all questions will be answered
- WhatsApp : +86 18659217588
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- Add : No. 39, Xinchang Road, Xinyang, Haicang Dist., Xiamen, Fujian, China (Mainland)
Cold Magnetron Sputtering Deposition System For Conductive Coating Of SEM Sample Preparation
Model Number:
TMAX-JY-JS02Input Power:
2000WCompliance:
CE CertifiedWarranty:
One Year limited warranty with lifetime supportShipping Port:
XiamenMOQ:
1Payment:
L/C D/A D/P T/T Western UnionDelivery Time:
5 days
- WhatsApp : +86 18659217588
- Email : David@tmaxcn.com
- Email : Davidtmaxcn@gmail.com
- Wechat : 18659217588
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Au/Pt/Pd/Ag Metal Sputtering Targets PVD Magnetron Sputtering Coating SystemNext:
Lab PVD Ion Sputtering Coater For Metal and Carbon Layer
Cold Magnetron Sputtering Deposition System For Conductive Coating Of SEM Sample Preparation
Model: TMAX-JY-JS02-Cold Magnetron Sputtering Deposition System
Product Description
The TMAX-JY-JS02 is a benchtop cold magnetron sputtering coating system equipped with a standard rotating/tilting sample stage. It is specifically designed for high-quality conductive coating of non-conductive samples with varied surface morphologies for SEM imaging. It also meets the requirements for electrode coating, semiconductor materials, and other thin-film applications.
Key Features
· "Ultra-Cold" Sputtering: Utilizes a high-efficiency, low-voltage DC magnetron source to prevent thermal damage to sensitive samples.
· Wide-Angle Coverage: Innovative magnetron design ensures uniform coating coverage, even for closely positioned samples.
· Fast Operation: Independent solenoid valves for venting, purging, and exhaust enable rapid system cycling.
· Stable Coating Performance: Precisely controlled sputtering current ensures consistent deposition rates and optimal coating quality, unaffected by chamber pressure.
· Multi-Material Compatibility: Supports various metal targets (Pt standard, optional Au, Au/Pd, or Pt/Pd) with quick and easy target replacement.
Technical Specifications
Sputtering System
Parameter |
Specification |
Target Material |
Standard: Pt (57mm diameter × 0.1mm thickness) Optional: Au, Au/Pd, Pt/Pd |
Sample Stage Rotation |
0–60 rpm (continuously adjustable) |
Sample Stage Tilt |
-45° to +45° (continuously adjustable) |
Stage Diameter |
40mm (holds 4 standard sample holders; custom sizes available) |
Sputtering Current |
Microprocessor-controlled (0–99 mA) with safety interlock |
Vacuum Range |
Atm ~3 Pa |
Control Method |
Programmable (1–999s) with Start/Pause buttons; automatic pumping/sputtering/venting |
Vacuum Pump
Parameter |
Specification |
Pumping Speed |
133 L/min |
Ultimate Vacuum |
0.05 Pa |
Noise Level |
56 dB |
Applications & Advantages
· Ideal for SEM Sample Preparation: Ensures high-conductivity coatings without thermal damage, critical for delicate or heat-sensitive materials.
· Versatile Material Deposition: Suitable for Pt, Au, and alloy coatings in semiconductor, nanotechnology, and materials research.
· User-Friendly Operation: Automated processes and ergonomic design enhance efficiency and reproducibility.
· Compact & Reliable: Benchtop design saves lab space while delivering professional-grade performance.
