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RF Magnetron Sputtering System for Metals & Non-Metals Film Deposition
RF Magnetron Sputtering System for Metals & Non-Metals Film Deposition Model: TMAX-SD-01-Metals & Non-Metals: Insulators, Semiconductors, Carbon-Based Thin Film Deposition Product Specifications Parameter Specification Model TMAX-SD-01 Type RF Magnetron Sputtering System Chamber Size 150 × 120 mm Target Material 50 mm diameter (metals & non-metals, thickness: 1–2 mm) RF Power Adjustable (1–500 W) RF Frequency 13.56 MHz Matching Network Automatic impedance matcher Sputtering Area 50 mm Ultimate Vacuum 5 Pa (base pressure) Process Gases Argon, nitrogen, and other inert gases (flow rate adjustable) Max. Deposition Rate 8 nm/min Key Features & Applications 1. Versatile RF Sputtering for Metals & Non-Metals · RF Power & Auto-Matching: 13.56 MHz RF with automatic impedance matching ensures stable sputtering of both conductive and insulating materials (e.g., oxides, ceramics). · Broad Applications: Ideal for advanced thin-film research in semiconductors, optics, and functional coatings. 2. Precise Gas Control & High Vacuum Performance · Adjustable Inert Gas Flow: Supports Ar, N₂, and other inert gases for controlled deposition environments. · High Purity Deposition: Base vacuum of 5 Pa minimizes contamination, ensuring high-quality film growth. 3. User-Friendly & Efficient Operation · Quick Target Change: Compatible with 50 mm targets (1–2 mm thick) for flexible material testing. · Preset Process Recipes: Saves and recalls parameters for repeatable experiments and production. 4. Stable & High-Speed Deposition · Max Deposition Rate: 8 nm/min with excellent film uniformity. · Automated Matching: Reduces manual tuning and enhances process stability. Recommended Applications ✔ Research & Development: Thin-film studies for semiconductors, dielectrics, and optical coatings. ✔ Small-Scale Production: Prototyping and specialized coating applications. ✔ Multi-Material Sputtering: Supports both metallic and non-metallic targets for diverse material systems. html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; }
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PVD Magnetron Sputtering System For Thin Film Deposition In Research, Semiconductor Prototyping and Optical Coating
PVD Magnetron Sputtering System For Thin Film Deposition In Research, Semiconductor Prototyping and Optical Coating Model: Lith-SD-JS02-Sputtering System for Research Labs, Semiconductor Prototyping, and Optical Coating Product Overview The Plasma Magnetron Sputtering System (Model: TMAX-SD-JS02) is a compact, user-friendly instrument designed for high-quality thin film deposition. With a quartz chamber (150 × 120 mm) and a maximum sputtering rate of 8 nm/min, it is ideal for research and small-scale production requiring precise, uniform coatings. Compatible with inert gases (Ar, N₂) and versatile metal targets (Au, Ag, Pt, etc.), this system combines efficiency with advanced operational features. Technical Specifications Parameter Specification Quartz Chamber Size 150 × 120 mm Sample Stage Size 70 mm (diameter) Sputtering Area 50 mm (diameter) Max. Vacuum Degree 5 Pa Process Gases Argon, Nitrogen (flow rate adjustable) Max. Sputtering Rate 8 nm/min Power Consumption 200 W Dimensions (W×D×H) 360 × 310 × 150 mm Operating Temperature 0–40°C Relative Humidity < 85% Installation Horizontal desktop placement Key Features & Advantages 1. Intuitive Control & Monitoring 4.3" color touchscreen with graphical interface for real-time display of sputtering current, voltage, and vacuum levels. 2. Flexible Gas & Target Options Adjustable inert gas flow (Ar/N₂) and support for 50 mm diameter metal targets (1–2 mm thickness), enabling quick material swaps and process reproducibility. 3. Modular & User-Centric Design ·Split-type quartz chamber for easy maintenance. ·Height-adjustable sample stage (±20 mm) with rotational alignment. ·Auto-venting post-sputtering simplifies sample handling. 4. Compact & Reliable ·Space-saving footprint with multi-layered software protections for extended durability. 5. Uniform Film Quality ·Dense, homogeneous coatings compatible with noble and transition metals (Au, Ag, Pt, etc.). Target Applications · Research Labs: Thin film studies, surface engineering, and material science. · Semiconductor Prototyping: Deposition of conductive/metallic layers. · Optics & Electronics: Functional coatings for sensors or display components. Note: Optimized for small substrates (≤50 mm) and low-to-medium throughput requirements. html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; } html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; }
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Versatile Magnetron Sputtering Coater For Conductive Metal Thin Film Layer Deposition
Versatile Magnetron Sputtering Coater For Conductive Metal Thin Film Layer Deposition Model: TMAX-BY-JS06-Benchtop System for R&D and Educational Laboratories Overview The TMAX-BY-JS06 is a compact, cost-effective, high-vacuum magnetron sputtering system designed for pilot-scale experiments in research and educational laboratories. It integrates key components, including a sputtering vacuum chamber, permanent magnet targets (strong/weak magnetic fields), a fiber-optic rotary stage (customizable), DC power supply, gas supply system, pumping system, water cooling system, film thickness monitoring, vacuum measurement, electronic control system, and a sturdy mounting frame. Key Parameters Parameter Specification Sputtering Gas Adjustable (e.g., argon, nitrogen, etc., depending on experimental requirements). Target Material Standard: Gold target; Optional: Silver, copper, chromium, etc. Target Configuration 50mm (weak magnetic target) / 60mm (strong magnetic target). Sputtering Current 0–500mA Ultimate Vacuum ≤5×10−4 Pa Chamber Dimensions Diameter: 180mm; Height: 200mm Sample Stage Fiber-optic rotary stage (customizable). Operating Voltage 230V, 50Hz Applications & Features 1. Coating for Electron Beam-Sensitive Samples · Ideal for: Biological specimens, polymers, and other beam-sensitive materials. · Advantage: In SEM imaging, high-energy electron beams can cause thermal damage to delicate samples. A thin sputtered conductive coating (e.g., gold or carbon) acts as a protective layer, preserving sample integrity while enhancing imaging quality. 2. Non-Conductive Samples · Ideal for: Insulating materials (e.g., ceramics, glass, or organic compounds). · Advantage: Non-conductive samples accumulate surface charges ("charging effect") under electron beams, distorting SEM images. A sputtered conductive metal layer (e.g., gold or platinum) dissipates charges, eliminating artifacts and improving signal-to-noise ratio for clearer imaging. 3. Electrode Fabrication & Conductivity Studies · Ideal for: Novel materials requiring conductive electrodes for electrical property analysis. · Advantage: Enables precise deposition of thin conductive films for experimental electrode fabrication, facilitating studies on material conductivity. html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; } html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; 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