Vacuum Magnetron Ion Sputtering Coater Optional Water Cooling Used to Coat Non-conductive Or Heat-sensitive SEM Samples

Sales Manager: Gia Email: Gia@tmaxlaboratory.com Wechat: Dingqiuna Whatsapp：+86 131 7450 6016 Skype: gia@tmaxcn.com

Mini DC Ion Sputtering Carbon Coater Coating Machine System

Mini DC Ion Sputtering Carbon Coater Coating Machine System     Product Overview The TMAX-BY-JS02 Ion Sputtering Coater is a DC (direct current) sputtering deposition system based on a two-electrode DC sputtering principle—a simple, reliable, and cost-effective coating technology widely adopted in industrial applications. Beyond its fundamental design, the TMAX-BY-JS02 features: · A dedicated sample sputtering chamber · Vacuum gauge and sputtering current meter · Adjustable sputtering current controller · Micro vacuum valve and timer · Integrated automated circuitry for precise control of chamber pressure, ionization current, and process gas selection, ensuring optimal coating quality. Key Innovations · Durable rubber-sealed bell jar design prevents vacuum leakage and edge chipping during prolonged use. · Ceramic-sealed high-voltage electrode outperforms conventional rubber seals in longevity. · Large-capacity sputtering chamber and optimized target area ensure uniform, contaminant-free coatings. · High-stability solenoid valves and a dual-gas-path automatic control system enhance sample protection and film quality. Ideal for: · SEM sample preparation in electron microscopy labs · Electrode fabrication for R&D research Technical Specifications Parameter Details Sputtering Gas Argon, nitrogen, or other gases (selectable per experiment) Target Material Standard: Gold target (50mm × 0.1mm thick). Optional: Silver, platinum, etc. Sputtering Current Max: 50mA Deposition Rate >4nm/min Chamber Dimensions Ø160mm × 120mm (H) Sample Stage Compatible with Ø50mm and Ø70mm stages (customizable) Power Supply 220V AC (110V optional), 50Hz   Features Highlight 1. Leap Vacuum Pump: High-performance pumping for consistent vacuum levels. 2. Dual-Gas Control: Isolated gas paths safeguard sample integrity. 3. User-Centric Design: Timed sputtering, adjustable parameters, and modular stage options streamline operation. Note: Parameters are default for standard configuration. Customizations (e.g., target materials, voltage) available upon request.   html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; } html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; } html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; } html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; }

Lab Ion Sputtering & Evaporation PVD Coater Machine for SEM for Glove Box

Lab Ion Sputtering & Evaporation PVD Coater Machine for SEM for Glove Box    TMAX-BY-JS03- Ion Sputtering & Evaporation Coater for SEM Specification Integrated with sputtering and thermal evaporation functions, this compact and user-friendly instrument is designed for high-quality thin-film deposition, particularly for SEM sample preparation. It supports multiple metal targets for sputtering and carbon fiber evaporation, offering precise control over coating parameters. Technical Specifications Parameter Value Dimensions 305 mm × 400 mm × 390 mm (W×D×H) Vacuum Chamber Material Borosilicate glass, 160 mm × 110 mm (D×H) Target (Upper Electrode) 50 mm × 0.1 mm (D×H) Sputtering Targets Au (standard), optional Ag, Pt, etc. Target Size φ50 mm Sample Stage Compatible with 50 mm/70 mm diameter; customizable Sputtering Voltage 0–1600 V (DC), adjustable Sputtering Current 0–50 mA Sputtering Timer 0–360 s Carbon Evaporation Current 0–100 A (AC) Evaporation Material Carbon fiber Evaporation Voltage 0–30 V Evaporation Time 0–1 s Gas Inlet Valve Compatible with φ3 mm tubing Process Gases Multiple options Power Supply 220 V (110 V optional), 50 Hz Vacuum Pump 2L rotary vane pump (VRD-8, domestic) Key Features 1. Dual-Function Design ·Combines ion sputtering (Au, Pt, Ag, Cu, etc.) and thermal evaporation (carbon fiber) for versatile applications. ·Ideal for high-resolution microscopy (SEM, TEM, EBSD) requiring ultra-fine carbon films (<1 nm). 2. Precision Control ·Adjustable sputtering current, vacuum pressure, and gas selection to optimize coating rate and particle size. ·Digital timer for reproducible processes. 3. Enhanced Sample Protection ·Conductive coatings eliminate charging effects in non-conductive samples. ·Carbon films protect beam-sensitive materials (e.g., biological/plastic samples) from electron beam damage. 4. Efficiency & Reliability ·Compact footprint with automated vacuum protection to prevent short circuits. ·Uniform film deposition with short processing time. Applications · Electron Beam-Sensitive Samples (e.g., polymers, biological tissues): Coating mitigates structural damage. · Non-Conductive Materials: Metal layers (Au, Pt) dissipate charge, improving SEM imaging. · Advanced Materials: Enhances conductivity and surface analysis (EBSD, microprobe) for semiconductors/composites. html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; 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Small Multi-target Metal Ion Sputtering Coater Machine

Small Multi-target Metal Ion Sputtering Coater Machine  TMAX-BY-JS11-Triple-Target Ion Sputtering Coater – Product Specifications Key Features · Triple-target design for multi-material deposition in a single run · DC sputtering technology ensures reliable, high-quality thin-film coating · Versatile applications for SEM sample preparation, conductive layer coating, and protective film deposition · Adjustable parameters (gas, current, vacuum) for optimized film properties Technical Specifications Parameter Details Target Materials Standard: Au (50mm × 0.1mm)   Optional: Ag, Al, Pt, and more Target Size 47mm diameter Control Mode Manual operation Chamber Dimensions Ø160mm × 120mm (H) Sample Stage Adjustable (Ø50mm/70mm standard, customizable) Sputtering Gas Ar, N₂, and others (selectable for different applications) Sputtering Current Max 50mA (recommended ≤30mA) Deposition Rate >40nm/min Vacuum System High-performance vacuum pump included Why Choose this? ✔ Multi-material coating – Deposit three different materials without breaking vacuum ✔ Enhanced SEM imaging – Reduces charging effects on non-conductive samples ✔ Precision control – Adjustable gas flow, current, and vacuum for optimal film uniformity ✔ Wide compatibility – Supports biological, polymer, and advanced material samples Applications · Electron-beam-sensitive samples (e.g., biological, polymers): Protective coating prevents beam damage · Non-conductive samples: Eliminates charging effects for crisp SEM imaging · Advanced materials research: Electrode fabrication and thin-film studies Standard Package Includes · Main unit with triple-target configuration · Gold target (50mm × 0.1mm) · High-performance vacuum pump · Adjustable sample stage (50mm/70mm) Optional Accessories · Additional target materials (Ag, Al, Pt, etc.) · Custom sample stage sizes Note: This machine is ideal for research labs, material science, and electron microscopy applications. Custom configurations available upon request. Optimized for Performance · Designed for Researchers (For detailed inquiries, contact our technical team for tailored solutions.)       html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; } html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; }

RF+DC Magnetron Ion Sputtering Coater Coating Machine For Non-Metals, Oxide, Ceramics

RF+DC  Magnetron Ion Sputtering Coater Coating Machine For Non-Metals, Oxide, Ceramics     Model: TMAX-BY-JS12| – Product Specifications Technical Specifications Parameter Specification Vacuum Pump System Rotary Vane Pump (Oil-lubricated) + Oil-Free Turbo Molecular Pump Set Rotary Pump Speed 50Hz: 16m³/h (4.4 L/s) | 60Hz: 19.2m³/h (5.2 L/s) Molecular Pump Speed 300 L/s Ultimate Vacuum 5 × 10⁻⁴ Pa Working Pressure 0.5 – 5 Pa Pump-Down Time >10 min (to 10 Pa) Vacuum Measurement Range: Atmosphere to 10⁻⁴ Pa Gas Control Mass Flow Controller (MFC) Chamber Size φ260mm × 200mm (Metal Chamber) Magnetron Target Source Target Size: φ50mm × 3mm (Copper)  Compatible with Weakly Magnetic Materials Operation Method Manual Control (Instruction Manual Provided) Weight / Dimensions 100kg / 610mm (L) × 420mm (W) × 490mm (H) Power Supply AC 110V 60Hz or AC 220V 50Hz Power Consumption <3000W Cooling System Air Cooling (Pump) + Water Cooling (Sputtering Target) Warranty 1-Year Limited Warranty with Lifetime Technical Support Key Features & Applications Core Advantages 1. Multi-Mode Sputtering Supports RF (Radio Frequency), DC (Direct Current), and RF+DC Hybrid modes for conductive, insulating, and composite material coatings. 2. High Vacuum Stability Turbo molecular pump (300 L/s) combined with a rotary pump ensures an ultimate vacuum of 5×10⁻⁴ Pa, guaranteeing high-purity and uniform films. 3. Flexible Compatibility ·Chamber size (φ260mm × 200mm) accommodates small to medium-sized samples. ·φ50mm target supports copper and weakly magnetic materials for diverse applications. 4. Efficient Cooling System ·Water-cooled target minimizes thermal load during high-power sputtering. · Air-cooled pump reduces maintenance costs for continuous operation. Typical Applications ·Research Fields Thin film deposition, nanostructured coatings, semiconductor device development. ·Industrial Uses Optical coatings, wear-resistant layers, surface modification of electronic components.       html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; } html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; } html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; }

Lab PVD Ion Sputtering Coater For Metal and Carbon Layer

Lab PVD Ion Sputtering Coater For Metal and Carbon Layer        Model: TMAX-JY-JS01-SEM Preparation Overview The TMAX-JY-JS01 compact magnetron ion sputtering coater is designed for high-quality conductive coating (e.g., gold film) on SEM samples or material surfaces. Featuring stable performance and user-friendly operation, it employs cold magnetron sputtering technology, minimizing heat generation to protect sensitive samples. Key Features · Durable Metal Bellows – Corrosion-resistant and aesthetically refined vacuum pump tubing. · Precision Adjustment – Sensitive micro-valve control with clear scale markings. · High-Efficiency Vacuum Pump – Fast pumping speed (8 m³/h) with low noise, ideal for lab environments. · Reliable Circuitry – Stable control board for consistent operation. · Cold Sputtering – Near-zero temperature rise preserves sample integrity. Technical Specifications Parameter Specification Vacuum Chamber Ø150 mm × 110 mm (H) Sample Stage Ø60 mm Gold Target Size Ø50 mm Vacuum System Pumping speed: 8 m³/h Vacuum Monitoring Custom Pirani gauge + analog dial Exhaust Mode Automatic Sputtering Time 0–1000 sec (programmable) Process Gas Air or argon (dedicated inlet) Compatible Target Materials Au, Au/Pd, Pt, Pt/Pd, Cu, Ag, etc. Dimensions ~450 × 330 × 235 mm (L×W×H) Applications & Advantages · SEM Sample Prep: Uniform conductive coatings enhance imaging accuracy. · Material Science: Versatile metal deposition for thin-film research. · User-Centric Design: Fast target switching, low maintenance, and lab-friendly noise levels. Ideal for: Academic labs, quality control, and R&D requiring precision coating with minimal thermal impact.   html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; 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High-Vacuum Dual-Target Magnetron Ion Sputtering Coating System Coater

High-Vacuum Dual-Target Magnetron Ion Sputtering Coating System Coater     Model: TMAX-HZ-JS04- High-Vacuum Dual-Target Sputtering Coater Technical Parameters Category Specification Model TMAX-HZ-JS04 Vacuum System Oil-free diaphragm pump + molecular pump Ultimate Vacuum ≤1.0×10⁻⁴ Pa Pressure Measurement Full-range cold cathode gauge + front-end Pirani gauge Gas Control MFC (Mass Flow Controller) for Ar/O₂/N₂ Target Configuration Dual targets (independent control, alternate/synchronous sputtering) Target Compatibility Metals, alloys, compounds (custom sizes available) Optional Feature Real-time thickness monitoring (nanometer precision) Cooling System Energy-efficient target cooling Safety Protections Overpressure/overcurrent/overheat protection, vacuum interlock, emergency vent Key Features 1. Dual-Target Flexibility ·Enables multi-material deposition (e.g., bilayers, graded films, or interfaces) in a single run. 2. High-Vacuum Precision ·Ultra-low base pressure (≤1.0×10⁻⁴ Pa) minimizes contamination for high-purity films. 3. Intelligent Process Control ·MFC-regulated gas flow ensures repeatable reactive sputtering (e.g., oxides/nitrides). 4. User-Optimized Design ·Energy-saving pumps and cooling reduce operational costs without compromising performance. Typical Applications · Semiconductors: Electrode/metallization layers, barrier films. · Optics: Anti-reflective, conductive, or hard coatings. · Energy: Thin-film batteries, solar cell layers. · Research: Nanomaterials, heterostructures, surface engineering. Why Choose? · Lab to Production: Scalable for both R&D prototyping and industrial batch processing. · Safety & Reliability: Automated safeguards protect equipment and users. · Customizable: Adaptable to diverse materials and film architectures.       html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; 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