Lab High-end Single Station Dip Coater Suitable for Dipping And Pull Film Preparation

Micron Range Programmable Dip Coater (1-500 um/sec) with Drying Oven upto 100°C

Economic Desktop Spin Coater (Max. 8000 rpm) with Complete Accessories

 Economic Desktop Spin Coater (Max. 8000 rpm) with Complete Accessories.

Touch Screen Compact Tape Casting Film Coating Machine with Dryer

200ºC Max. Automatic Film Coater with Dryer Cover and 140mm Doctor Blade TMAX-JK-TMJ-200 is a CE Certified ready compact tape casting coater with a heating cover designed to produce films with consistent thickness. It has a unique driving system to produce a smooth coating on all types of materials. The flat vacuum chuck is built in to hold the substrate sheet in place, which is particularly useful when making thin coatings. One 140 mm width adjustable micrometer applicator (doctor-blade). Heating cover with digital temperature controller can dry films after coating up to 200°C with a temperature accuracy of +/-1°C. This equipment can be used for researchers on ceramic tape castings and Li-Ion battery electrode coating.

RF+DC Magnetron Ion Sputtering Coater Coating Machine For Non-Metals, Oxide, Ceramics

RF+DC  Magnetron Ion Sputtering Coater Coating Machine For Non-Metals, Oxide, Ceramics     Model: TMAX-BY-JS12| – Product Specifications Technical Specifications Parameter Specification Vacuum Pump System Rotary Vane Pump (Oil-lubricated) + Oil-Free Turbo Molecular Pump Set Rotary Pump Speed 50Hz: 16m³/h (4.4 L/s) | 60Hz: 19.2m³/h (5.2 L/s) Molecular Pump Speed 300 L/s Ultimate Vacuum 5 × 10⁻⁴ Pa Working Pressure 0.5 – 5 Pa Pump-Down Time >10 min (to 10 Pa) Vacuum Measurement Range: Atmosphere to 10⁻⁴ Pa Gas Control Mass Flow Controller (MFC) Chamber Size φ260mm × 200mm (Metal Chamber) Magnetron Target Source Target Size: φ50mm × 3mm (Copper)  Compatible with Weakly Magnetic Materials Operation Method Manual Control (Instruction Manual Provided) Weight / Dimensions 100kg / 610mm (L) × 420mm (W) × 490mm (H) Power Supply AC 110V 60Hz or AC 220V 50Hz Power Consumption <3000W Cooling System Air Cooling (Pump) + Water Cooling (Sputtering Target) Warranty 1-Year Limited Warranty with Lifetime Technical Support Key Features & Applications Core Advantages 1. Multi-Mode Sputtering Supports RF (Radio Frequency), DC (Direct Current), and RF+DC Hybrid modes for conductive, insulating, and composite material coatings. 2. High Vacuum Stability Turbo molecular pump (300 L/s) combined with a rotary pump ensures an ultimate vacuum of 5×10⁻⁴ Pa, guaranteeing high-purity and uniform films. 3. Flexible Compatibility ·Chamber size (φ260mm × 200mm) accommodates small to medium-sized samples. ·φ50mm target supports copper and weakly magnetic materials for diverse applications. 4. Efficient Cooling System ·Water-cooled target minimizes thermal load during high-power sputtering. · Air-cooled pump reduces maintenance costs for continuous operation. Typical Applications ·Research Fields Thin film deposition, nanostructured coatings, semiconductor device development. ·Industrial Uses Optical coatings, wear-resistant layers, surface modification of electronic components.       html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; } html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; } html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; }

PVD DC Sputtering Coating System For Oxides & Ceramics & Semiconductors

PVD DC Sputtering Coating System For Oxides & Ceramics & Semiconductors   Model: TMAX-BY-JS09| – Product Specifications Product Overview The TMAX-BY-JS09 is a compact, high-vacuum magnetron sputtering system specifically designed for glovebox-integrated applications. Its space-saving flush-mount design allows the observation window to align perfectly with the glovebox wall, eliminating internal space occupation—a common limitation of traditional sputtering systems. Since its launch, this system has been widely adopted by research institutions for its efficiency and precision. Technical Specifications Category Specification Vacuum System Rotary vane pump (oil) + Turbo molecular pump (oil-free) Pumping Speed Rotary pump: 16 m³/h (4.4 L/s) @50Hz / 19.2 m³/h (5.2 L/s) @60Hz  Turbo pump: 300 L/s Ultimate Vacuum 5×10⁻⁵ Pa Working Pressure 0.5–5 Pa Pump-Down Time ≤10 min (to 10⁻³ Pa) Vacuum Measurement From atmosphere to 10⁻⁶ Pa Gas Control Precision gas flow controller Chamber Size φ260 mm × 200 mm (metal) Sputtering Target φ50 mm × 3 mm (Cu target); suitable for weakly magnetic materials Power Supply AC 220V 50Hz or AC 110V 60Hz Power Consumption ≤3000 W Cooling System Air cooling (pump) + Water cooling (sputtering target) Dimensions & Weight 610 mm (L) × 420 mm (W) × 490 mm (H) / ~100 kg Warranty 1-year limited warranty, lifetime technical support Key Features & Customer Benefits 1. Space-Saving Glovebox Integration · Problem Solved: Traditional sputtering systems occupy valuable glovebox space, limiting workflow efficiency. · Our Solution: The flush-mounted design minimizes protrusion, allowing seamless integration without compromising internal workspace—ideal for labs with limited glovebox capacity. 2. High-Performance Vacuum & Fast Pump-Down · Achieves 5×10⁻⁵ Pa ultimate vacuum, ensuring ultra-clean deposition conditions for sensitive materials (e.g., semiconductors, optical coatings). · Rapid pump-down (≤10 min to 10⁻³ Pa) reduces idle time, enhancing lab productivity. 3. Precision Process Control · Stable gas flow control enables repeatable deposition rates, critical for uniform thin-film growth. · Broad vacuum measurement range (atmosphere to 10⁻⁶ Pa) ensures accurate monitoring across all process stages. 4. Versatile Material Compatibility · Supports argon and other process gases for reactive/non-reactive sputtering. · Accommodates 50mm targets (Cu standard, customizable for weakly magnetic materials). 5. Reliable Cooling & Safety · Hybrid air + water cooling prevents overheating during extended operation, ensuring system longevity.       html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-anchor { border:1px dashed #666; width:16px; height:16px; } .ke-script, .ke-noscript, .ke-display-none { display:none; font-size:0; width:0; height:0; } .ke-pagebreak { border:1px dotted #AAA; font-size:0; height:2px; }

Carbon Fiber Automatic Laminating & Coating Machine

The hot melt coating machine uses a hot melt adhesive heating tank and a special hot melt adhesive extrusion coating head to achieve uniform coating. Lamination and die-cutting are optional.

Roll to Roll Coating Machine with 6 Meter Drying Oven For Lithium Ion Battery

The coating machine TMAX-DYG-132MS is a single face continuous and Intermittent coating machine mainly used for Slurry drying process of lithium battery electrode coating. The battery coating machine adopts continuous and Intermittent coating mode, is mainly used for lithium battery pilot scale production line.

Dip Coater (1-200 mm/min) with Drying Oven up to 100°C

Dip Coater (1-200 mm/min) with Drying Oven up to 200°C 

Customizable Meyer Rod Coating Machine Metering Rod Coater

The hot melt coating machine uses a hot melt adhesive heating tank and a special hot melt adhesive extrusion coating head to achieve uniform coating. Lamination and die-cutting are optional.

Programmable Hi-Speed Spin Coater (10K rpm & 5" max) with Vacuum Chucks (Optional Heating Cover)

Programmable Hi-Speed Spin Coater (10K rpm & 5" max) with Vacuum Chucks (Optional Heating Cover)

Lab PVD Ion Sputtering Coater For Metal and Carbon Layer

Lab PVD Ion Sputtering Coater For Metal and Carbon Layer        Model: TMAX-JY-JS01-SEM Preparation Overview The TMAX-JY-JS01 compact magnetron ion sputtering coater is designed for high-quality conductive coating (e.g., gold film) on SEM samples or material surfaces. Featuring stable performance and user-friendly operation, it employs cold magnetron sputtering technology, minimizing heat generation to protect sensitive samples. Key Features · Durable Metal Bellows – Corrosion-resistant and aesthetically refined vacuum pump tubing. · Precision Adjustment – Sensitive micro-valve control with clear scale markings. · High-Efficiency Vacuum Pump – Fast pumping speed (8 m³/h) with low noise, ideal for lab environments. · Reliable Circuitry – Stable control board for consistent operation. · Cold Sputtering – Near-zero temperature rise preserves sample integrity. Technical Specifications Parameter Specification Vacuum Chamber Ø150 mm × 110 mm (H) Sample Stage Ø60 mm Gold Target Size Ø50 mm Vacuum System Pumping speed: 8 m³/h Vacuum Monitoring Custom Pirani gauge + analog dial Exhaust Mode Automatic Sputtering Time 0–1000 sec (programmable) Process Gas Air or argon (dedicated inlet) Compatible Target Materials Au, Au/Pd, Pt, Pt/Pd, Cu, Ag, etc. Dimensions ~450 × 330 × 235 mm (L×W×H) Applications & Advantages · SEM Sample Prep: Uniform conductive coatings enhance imaging accuracy. · Material Science: Versatile metal deposition for thin-film research. · User-Centric Design: Fast target switching, low maintenance, and lab-friendly noise levels. Ideal for: Academic labs, quality control, and R&D requiring precision coating with minimal thermal impact.   html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/media.gif); background-position:center center; 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Nano Vacuum Magnetron Ion Sputtering Coater For Thin Film Fabrication

Nano Vacuum Magnetron Ion Sputtering Coater For Thin Film Fabrication     Model:  TMAX-ZK-JS05- Compact Ion Sputtering Coater Overview The TMAX-ZK-JS05 Compact Ion Sputtering Coater is designed for depositing conductive gold films on samples for scanning electron microscopy (SEM). With user-friendly operation, it is an essential tool for sample preparation in small to medium-sized SEM laboratories. Key Applications · Gold ion sputtering for SEM sample coating. · Compatible with target materials: Au, Pt, Cr, Ag, Ti, Cu, Ni, Au-Pd alloy, etc. Technical Specifications Category Specification Chamber Material Glass Chamber Dimensions Ø100 mm (diameter) × 130 mm (height) Sample Stage (Small) Ø40 mm (holds 6 sample cups simultaneously) Sample Stage (Large, Optional) Ø60 mm Gold Target Size Ø58 mm Vacuum Pump Two-stage direct-drive rotary vane pump (1 L/s) Vacuum Measurement Pirani gauge Vacuum Protection 20 Pa with fine-adjustment gas inlet valve Working Gases Air / Argon (dedicated inlet with flow control) Features & Advantages · Robust Design – Special sealing structure minimizes glass chamber damage. · High Compatibility – Supports Au, Pt, Cr, Ag, Ti, Cu, Ni, and Au-Pd alloy targets. · Precision Control – Adjustable gas flow and vacuum protection ensure uniform coatings. · Efficient Workflow – Dual-stage platform allows batch processing (6 samples at once). Recommended Applications ✔ SEM Sample Prep – Ideal for non-conductive specimen coating. ✔ Materials Research – Thin-film deposition for nanotechnology studies. ✔ Industrial QC – Reliable performance for repeatable conductive layering.     html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-media { border:1px solid #AAA; 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PVD Magnetron Sputter Coating System For SEM & Wafer Sample Preparation

PVD Magnetron Sputter Coating System For SEM & Wafer Sample Preparation       Model:  TMAX-ZK-JS04- DC Ion Sputtering Coater Technical Specifications Parameter Specification Target Materials Standard: Au (Gold), 57mm diameter × 0.1mm thick  Optional: Pt (Platinum) Standard Sample Holder Holds 12 SEM stubs, height adjustment range: 60mm Rotating/Tilting Stage (Optional) Rotation: 0–60 rpm (continuously adjustable)  Tilt: -90° to +90° (continuously adjustable)  Standard rotating platform: 40mm diameter (holds 4 sample holders, custom sizes available)  Dual locking mechanism for secure fixation Sputtering Current 5–30mA (microprocessor-controlled, programmable) Meters Vacuum: Atm – 1×10⁻³ mbar  Current: 0–99mA Control Method Microprocessor with Start/Pause buttons  Programmable time (1–999s)  Auto-pumping, sputtering, and venting Vacuum System Pumping speed: 133 L/min  Ultimate vacuum: 10⁻⁴ mbar  Noise level: 56 dB Key Features & Applications 1. Precision and Flexibility · Adjustable sputtering current (5–30mA) and rotating/tilting stage enable uniform thin-film deposition for diverse sample geometries. · Dual locking mechanism prevents sample displacement during operation. 2. High-Quality Coating · Gold (Au) and Platinum (Pt) targets ensure high-purity conductive coatings for SEM and analytical applications. 3. Automated & User-Friendly Operation · Programmable controls and auto-venting enhance efficiency and safety. 4. Compact & Low-Noise Design · Stainless steel chamber (120mm × 75mm) with observation window (120mm × 45mm) provides durability and visibility. · Low 56 dB noise level ensures a comfortable working environment. Ideal Applications · SEM sample preparation (conductive coating) · Thin-film deposition for research and industrial applications · Multi-sample processing (supports 12 SEM stubs) · Angle-dependent deposition (with optional rotating/tilting stage) This sputtering system is optimized for laboratories requiring high precision, automation, and versatile coating capabilities.     html {margin:0;padding:0;} body {margin:0;padding:5px;} body, td {font:12px/1.5 "sans serif",tahoma,verdana,helvetica;} body, p, div {word-wrap: break-word;} p {margin:5px 0;} table {border-collapse:collapse;} img {border:0;} noscript {display:none;} table.ke-zeroborder td {border:1px dotted #AAA;} img.ke-flash { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/flash.gif); background-position:center center; background-repeat:no-repeat; width:100px; height:100px; } img.ke-rm { border:1px solid #AAA; background-image:url(https://www.lithmachine.com/js/htmledit/kindeditor/themes/common/rm.gif); 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